Embedded Systems Conference
Breaking News
Comments
Duane Benson
User Rank
Author
re: TI pushes pillar flip-chip for next-gen ICs
Duane Benson   7/7/2010 5:56:41 PM
NO RATINGS
I'd like to hear a bit more about this in terms of the practical use of the parts. It's interesting in terms of cost savings and performance improvements but the use of the part is an important consideration too. Ti's OMAP processor ends up on a 0.4mm pitch BGA package. That means tighter space and trace limits for the PCB layout as well as vias in the BGA land pads (please fill and plate the vias in the pads). Expect to see this leading to even smaller pitches on the components. I haven't yet seen a 0.3mm pitch part I have heard that they are on the way.

georgegrimes
User Rank
Author
re: TI pushes pillar flip-chip for next-gen ICs
georgegrimes   7/8/2010 2:10:09 PM
NO RATINGS
How does one shrink something 300%? After you shrink it 100% it is zero in size.

selinz
User Rank
Author
re: TI pushes pillar flip-chip for next-gen ICs
selinz   7/16/2010 12:34:25 AM
NO RATINGS
Don't confuse the IC bump pitch with the package bump pitch. Current production IC's are often in the 150 to 250 micron pitch range, while it sounds like this will be closer to 50 microns! That's going to really challenge probe cards, since even 80 micron area array is tough to pull off these days. Often the package can be used as the space transformer for the probe head. Tricky stuff though... Of course this works for 1 up.. Multi-up represents a new challenge. Finally, they haven't talked about the substrate, which is really the enabler. Finer pitch probably means no solder mask, Sn cap, and 1 or 2 mil traces.. Cool stuff. There aren't that many places that can pull that off.



Radio
LATEST ARCHIVED BROADCAST
Overview: Battle-hardened veterans of the electronics industry have heard of the “connected car” so often that they assume it’s a done deal. But do we really know what it takes to get a car connected and what its future entails? Join EE Times editor Junko Yoshida as she moderates a panel of movers and shakers in the connected car business. Executives from Cisco, Siemens and NXP will share ideas, plans and hopes for connected cars and their future. After the first 30 minutes of the radio show, our listeners will have the opportunity to ask questions via live online chat.
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...