If memory serves me correctly, the master imprint mask is written with an e-beam writer, but the replica masks are produced using the same nanoimprint process used for IC production -- the master mask imprints the replica masks. So e-beam write times shouldn't be a major factor.
I'd imagine if EUV tools were available in 2011-2012, some companies would still be able to skip immersion and double patterning entirely, catching up to those who bought EUV, and immersion, and double patterning. The dragging out of 193 nm technology has enabled leaders to keep their lead.
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