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resistion
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re: Lithography roadmap offers questions and openings
resistion   7/16/2010 7:42:40 AM
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Mind the ebeam write time for those imprint masks!

unknown multiplier
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re: Lithography roadmap offers questions and openings
unknown multiplier   7/16/2010 12:05:55 PM
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I'd imagine if EUV tools were available in 2011-2012, some companies would still be able to skip immersion and double patterning entirely, catching up to those who bought EUV, and immersion, and double patterning. The dragging out of 193 nm technology has enabled leaders to keep their lead.

walken1
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re: Lithography roadmap offers questions and openings
walken1   7/16/2010 3:21:30 PM
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If memory serves me correctly, the master imprint mask is written with an e-beam writer, but the replica masks are produced using the same nanoimprint process used for IC production -- the master mask imprints the replica masks. So e-beam write times shouldn't be a major factor.

resistion
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re: Lithography roadmap offers questions and openings
resistion   7/16/2010 4:38:04 PM
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The replication part is great but beam conditions drift which can cause overlay problems or other defects given enough time. Maybe multibeam + imprint is the answer?

jokosa
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re: Lithography roadmap offers questions and openings
jokosa   7/16/2010 6:46:40 PM
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Whatever happened to interferometry nodes? I have not heard of them for 10 years, but coupled with todays spacial patterning it seems like an idea ready for more research...

me3
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re: Lithography roadmap offers questions and openings
me3   7/16/2010 7:08:51 PM
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While Intel marches on and on and on with a few fully depreciated steppers ..... Why the genius at GF doesn't notice? And they just separated design from manufacturing.

goafrit
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re: Lithography roadmap offers questions and openings
goafrit   7/17/2010 4:02:13 PM
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Yes, it is happening in China where all the big firms are pumping research money. They make so much abroad and hate to send back to US to avoid paying taxes. Suddenly they have to spend that money offshore. That is where it is happening

pixies
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re: Lithography roadmap offers questions and openings
pixies   7/17/2010 6:21:10 PM
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even with NA = 1.3, interferometric tools give you ~ 45 nm pitch with 193 nm light. Plus double patterning you get to 22 nm. That's a one generation tool. Let alone the lack of maturity and versatility of the interferometric tools.

Diogenes53
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re: Lithography roadmap offers questions and openings
Diogenes53   7/17/2010 10:43:28 PM
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The ebeam write time for imprint masks is virtually irrelevant. The ebeam written masks will be used for masters to make very cheap (~$5K) mask replicas using a specially designed imprint mask replication tool. A master can produce thousands and thousands of replicas, thus amortizing the master cost to virtually zero.

Diogenes53
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re: Lithography roadmap offers questions and openings
Diogenes53   7/17/2010 10:48:21 PM
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If EUV tools are available in 2011-2012, they will most likely be beta tools which cost well over $100 million each and run at a few wafers per hour. No company can afford that kind of "leadership".

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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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