This technology looks to be promising enough in reducing effective carbon emission and green house gases , by elimination of CFCs and by reduction in Electricity consumption. Early commercialization of such technologies is the need of the hour.
The article states that this technology will allow refrigeration without the emission of greenhouse gasses. That sounds like a distortion to me, the majority of greenhouse gas emission for refrigeration systems is in the electricity they consume. Refrigerants are considered a greenhouse gas, but are not normally released in refrigerant operations.
I assume this process still consumes electricity. Perhaps it is more efficient than a gas-liquid refrigerant cycle. Would be helpful if there the article contained some estimates on efficiency relative to current solutions in the article.
Does anyone know of other efforts to harness these thermoelastic shape memory alloys? I know that nitinol wire has been used in robotics, because when heated above its transformation temperature it can be stretched to 30 times its normal length, which it recovers when it cools. Also if you stretch it when its already cool, it will "remember" its original length when heated to its transformation temperature. I'm not familiar with other applications, though. Does anyone know of other efforts to harness these thermoelastic shape memory alloys?
An interesting technology for cooling with a number of potential applications. I wonder if it could be used to provide cooling for ICs that enable them to run faster while dissipating the die heat? Could the process be reversed like a heat pump to extract geothermal heat or to generate power? I would love to know more about how this works.
My Mom the Radio Star Max MaxfieldPost a comment I've said it before and I'll say it again -- it's a funny old world when you come to think about it. Last Friday lunchtime, for example, I received an email from Tim Levell, the editor for ...
A Book For All Reasons Bernard Cole1 Comment Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...