It's always the same analysts, same vendor, same company people cheering EUV. So I do think it is hype.
But just look objectively at the numbers for 3100 and 3300. It is already admitted that the throughput for 3100 is not sufficient for production. So clearly buying it is simply for learning, indicating that it is largely a mystery with lots of risk for whoever bought it. And that said, the 3300 (designed but not yet built) only offers modest 22 nm resolution, which is not the optical limit but calculated from some other considerations (resist, flare).
I think too much money has been spent money over too long a duration. EUV qualifies as pork barrel. The fact that 193 nm has been extended this far indicates how much EUV has been a let down. In the 1990's there was some work on using STM for lithography. I think 20 years of development could have been targeted on developing the parallelism for a high-throughput approach there.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.