Demand for chips made on 200-mm wafers is clearly dropping faster than the manufacturing capacity is contracting, hence the falling wafer price. While on 300-mm wafers, which tends to be leading edge digital processes and where capacity is increasingly modestly at present, it would seem that demand is climbing at about the same pace.
Nonetheless, on both wafer sizes, it looks like Q2 might represent a transition from an under supply of wafers and rising wafer prices to an oversupply situation. The next quarterly survey from GSA towards the end of the year should reveal what happened in Q3.
It shows somewhat strange results as 200nm production is reduced compared to 300nm productions are unchanged, this is somewhat unexpected outcome.
Still it is good for the electronic product industries.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.