This is not a suprising news, especially nowadays when everybody in the market struggles with extended LTs and allocation issues since long. Almost all founderies announced plans to spend tremendous amount of money to their fabs such as TSMC, GB, Samsung, Intel etc. However i'm still missing a part in the puzzle. Still no plan to switch 450mm wafers? Why nobody is focusing on larger scale wafer processing? Only intel had some movements but rest?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.