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Sam Beal
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re: GSA kicks off 3-D chip, MEMS work
Sam Beal   11/15/2010 1:05:27 PM
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TSV involves ultra-thin wafer handling and dry etching - both of which exist. Through-put is a challenge. system integration presents a different set of assembly challenges, as well as reliability issues. I worked on this 5 years ago and thought it was more than 5 years away, but momentum is building.

unknown multiplier
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re: GSA kicks off 3-D chip, MEMS work
unknown multiplier   9/22/2010 2:17:12 PM
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Samsung's OneDram and Intel's Sandy Bridge and Tunnel Creek show that combining two or more chips into one remains more powerful than stacking them.

resistion
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re: GSA kicks off 3-D chip, MEMS work
resistion   9/20/2010 6:15:39 PM
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Heat would be an issue if a cpu is in the stack. But I've seen heat sink for dram as well, a little to my surprise. Taking things off chip in 3d looks counter to SoC trend. Maybe it's more suitable for memory. But even there 3d gets competition from wide interconnect in top layer.

Rajiv.Roy
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re: GSA kicks off 3-D chip, MEMS work
Rajiv.Roy   9/20/2010 5:49:55 PM
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I don't think the heat dissipation is that a big a deal. Today you have memory, logic/memory and other 3d stacks. They have been shipping for a while. Only difference is they are wire-bonded, not connected using TSV. There are other significant issues, such as via processing costs and lack of standards that are the bigger inhibitors.

MikeLC
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re: GSA kicks off 3-D chip, MEMS work
MikeLC   9/18/2010 7:04:49 PM
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Yes, until better dissipation methods exist, this tech is going to be very slow in coming. My opinion only.

p51
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re: GSA kicks off 3-D chip, MEMS work
p51   9/17/2010 12:37:48 PM
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In addition to what greenpattern has mentioned I imagine the need for common design tools and common die interfaces from the different companies will be necessary. But the big players will still be driven to have their own proprietary techniques. It will be interesting to see how all of this comes together sooner or later.

greenpattern
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re: GSA kicks off 3-D chip, MEMS work
greenpattern   9/17/2010 8:51:38 AM
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TSV or not, vertically stacked components cannot dissipate heat vertically. This is a big issue. Some have even proposed microfluidics to deal with this.

BalaLak
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re: GSA kicks off 3-D chip, MEMS work
BalaLak   9/17/2010 5:30:58 AM
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Will 3-D require new fabs? Or can existing fabs support TSVs? This seems to be an interesting technology, no doubt, but of use only to those companies that make huge devices (in terms of silicon real estate) such as Intel. I am sure the majority of the semiconductor companies out there are nowhere near the mark where 3-D will result in significant cost savings for them. I also don't think power savings alone will warrant a shift towards adopting 3-D.

rick merritt
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re: GSA kicks off 3-D chip, MEMS work
rick merritt   9/17/2010 4:21:11 AM
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My opinion is in the 3-D era--if it comes--systems engineers will need to get much more intimately involved in semiconductor design. This could be a huge shift, one of many the technology could bring.

resistion
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re: GSA kicks off 3-D chip, MEMS work
resistion   9/17/2010 3:43:34 AM
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Something to consider is the impact on motherboard and PCB makers, since the various IC's on the board would be stacked together by TSV's.

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