By the way, the article says the amount paid is not disclosed! Perhaps the author forgot to Google it; here it is, widely available on the internet (the amount paid was 10M Euros):
The article quotes:
Bank of Ireland Kernel Capital Equity Fund had a 40% shareholding in ChipSensor. The total sale price is reported to be around €10m.
@elPresidente, @iniewski and others: it is possible to have regions of sacrificial sensing areas in your IC that is well segregated from other areas protected under final oxide/nitride passivation. It could also be a scenario where the sensing area's integrity is recovered through a closed loop heating circuit; this only works for moisture but I don't know how other gases are sensed in ChipSensor's products.
As with the current state of 3D technology, it is crucial for MEMS products to be on a development roadmap where they can be easily integrated with a 3D chip stack via TSV's. SiliconLabs is worth keeping an eye on!
Dr. MP Divakar
It will be interesting to see plethora of applications derived from this type of devices. We will eagerly look forward to read first few datasheets for these devices. How many sensing functions will be implemented on one device? Or will there be one device per type of sensor? Will output be digital and will it be self calibrated? How do you set lower and upper range of sensing? Can we program alarm limit? Also, can I integrate them in my hybrid to design lab on chip?
As iniewski says....sensors are intended to exist in variable humidity and temperature (if that is what they are measuring and being calibrated against).
Passivation is there for good reason but it is also why ChipSensors spent four years developing and demonstrating their over-the-CMOS technology. It seems that Silicon Labs thinks it's got legs.
One also suspects that as a startup ChipSensors may have had problems getting design wins to stick.
Sometimes it is a prospective customer that makes these M&As happen, by saying: "I want to buy this technology but I can't buy it from the startup developer because they could go bust leaving me high and dry. But if a big name company on my supplier list bought them i could buy the technology. You big company will buy this small company and start shipping product to me. Make it so."
I remember Wally Rhines, then new in at Mentor Graphics, telling me that happened in the EDA sector.
Hi elPresidente, I would not dismiss this technology so quickly...any sensor technology has to deal with humidity, mechanical stress, thermal cycling, etc. the list is long...fabless IC makers have to adapt and accomodate sensor platforms, jsut doing some CMOS design will be sufficient to stay on the top in my opinion...Kris
As a conservative design engineer, I have to wonder what happens to the entrapped moisture in this hygroscopic material when someone steps out of a humid building into a crisp January evening in Minneapolis daily over the course of a few weeks? This smells like it came out of a university - passivation is required on chips for good reasons.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.