noise problem? The phase noise seems a little lower than in other types of CMOS oscillators and should be much lower at the frequencies at which it is user configurable.
I'm also pretty sure it will have an option of being separately packaged, since wire bonding is also used for linking silicon to the package. That's my 2 cents anyway.
Very nice solution. I guess with the noise problems, it will never be integrated onto the ASIC. Can it be used in a separate package in the system or does it have to be packaged with the ASIC to avoid stray capacitance and ground loop issues?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.