Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
resistion
User Rank
Author
re: Analyst: Intel preparing 450-mm push
resistion   10/26/2010 6:09:21 AM
NO RATINGS
Intel's 22 nm chips are coming out next year. It is almost certainly too late to do anything about 15 nm now. In two-three years, 11 nm node process needs to be frozen by Intel. I don't think any wafer size change or EUV lithography will happen during that time. It is just too soon. They would rather focus on changing the transistor from planar to 3D.

dnenni
User Rank
Author
re: Analyst: Intel preparing 450-mm push
dnenni   10/26/2010 3:55:33 AM
NO RATINGS
450mm Semiconductor Manufacturing is an interesting debate: http://wp.me/psH60-1x5 My guess is that we will see 450mm by the end of the end of the decade.

RobDinsmore
User Rank
Author
re: Analyst: Intel preparing 450-mm push
RobDinsmore   10/26/2010 3:34:23 AM
NO RATINGS
Intel does not fully invest in America. None of it's Etch tools come from the US. This is in spite of the fact that LAM, based 5 miles or so from Intel's HQ is the market leader in Etch. It's really kind of sad for them because they miss out on the great collaborative nature that Intel's think films groups have with the US based tool manufacturers. To truly invest in America, Intel needs to invest in it's American partnerships and that means seriously considering dumping some money on American made and supported Etch tools. It will create more jobs in the US than just building another high tech sweat shop for Ph.D.s.

mcgrathdylan
User Rank
Author
re: Analyst: Intel preparing 450-mm push
mcgrathdylan   10/25/2010 11:51:51 PM
NO RATINGS
With Intel pushing 450-mm the way they are, it seems like a no brainer that this facility will be built to accommodate 450-mm. Considering how soon Intel would like 450-mm to be ready, it would seem short sighted not the build the development fab to accommodate it. Of course 450 won't be ready when Intel wants it. But Intel needs to walk the walk. I wouldn't be surprised to see them make some public statements about this facility being 450-ready as a way to draw a line in the sand, so to speak. I was actually kind of surprised that they didn't state this in the announcement.

mark.lapedus
User Rank
Author
re: Analyst: Intel preparing 450-mm push
mark.lapedus   10/25/2010 8:16:52 PM
NO RATINGS
Does 450-mm make any sense or not?

goafrit
User Rank
Author
re: Analyst: Intel preparing 450-mm push
goafrit   10/25/2010 7:35:44 PM
NO RATINGS
It is a bold initiative for Intel to invest in America. That is how the future of the nation will be secured. It is necessary and should be commended by all. One hopes they have the right roadmap for the litho business.

<<   <   Page 2 / 2


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
The quality and reliability of Mill-Max's two-piece ...
01:34
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...