Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
docdivakar
User Rank
CEO
re: TI, Maxim ramp 300-mm analog chips
docdivakar   11/23/2010 9:31:21 PM
NO RATINGS
One more factor to consider in the discussion: many analog and mixed signal chip companies cited in the article above also have digital products and/or partnerships that are already in the 300mm wafer fab. With the evolving 3D stacked chip products & market opportunity, it is now a question of being compatible with the digital products in a stack, in particular wafer-to-wafer. Even without the 3D stacking scenario, much of the wafer-level chip packaging now a days takes place in the 300mm processes. Cost is a major driver and as quoted in the article, higher gross margins are always welcome. Dr. MP Divakar

GREAT-Terry
User Rank
CEO
re: TI, Maxim ramp 300-mm analog chips
GREAT-Terry   11/8/2010 3:23:40 PM
NO RATINGS
Many analog IC are not as complex as digital IC in terms of number of transistors used. The silicon cost is only a very small portion but test cost and design cost (expertize as there is practically no good simulation and synthesis tools for analog design). So, moving to 300mm many only solve part of the delivery issue but may not really lower the overall cost too much. However, high performance analog market usually is not in huge volume. Companies including MAXIM enjoys great profit margin with low volume high performance sockets. When it comes to volume, people usually are willing to trade performance for price. I'm not sure if 300mm manufacturing process can help.

sranje
User Rank
Manager
re: TI, Maxim ramp 300-mm analog chips
sranje   11/7/2010 10:35:45 PM
NO RATINGS
300mm will be mainly used for highly integrated mixed-signal power management products - in 180 and 130nm nodes - pure analog ICs will remain in 0.35 micron and older nodes. Note that big foundries, e.g., TSMC and UMC can offer 300mm analog technology platforms, that is, 300mm is not a major barrier or differentiation.

sranje
User Rank
Manager
re: TI, Maxim ramp 300-mm analog chips
sranje   11/7/2010 12:23:07 PM
NO RATINGS
The impact of 300mm is likely overstated and may be limited to large chips - a la MOSFETs (discretes). Maxim will use both 200 and 300mm outsourcing. A bigger impact is the emergence of analog technology platforms - this megatrend benefits foundries and fabless start-ups. Unlike in Digital, start-up formation, hence also M&A activity, is high in Analog fabless space

selinz
User Rank
CEO
re: TI, Maxim ramp 300-mm analog chips
selinz   11/5/2010 11:41:32 PM
NO RATINGS
Given that TI just purchased an additional 300mm fab in Japan that they apparently intend to devote to analog, they must feel as though it makes sense...



Most Recent Comments
DrFPGA
 
DrFPGA
 
DrFPGA
 
DrFPGA
 
AZskibum
 
DrFPGA
 
DrFPGA
 
AZskibum
 
AZskibum
Most Recent Messages
11/26/2014
10:08:26 AM
Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Book Review: Deadly Odds by Allen Wyler
Max Maxfield
Post a comment
Generally speaking, when it comes to settling down with a good book, I tend to gravitate towards science fiction and science fantasy. Having said this, I do spend a lot of time reading ...

Martin Rowe

No 2014 Punkin Chunkin, What Will You Do?
Martin Rowe
Post a comment
American Thanksgiving is next week, and while some people watch (American) football all day, the real competition on TV has become Punkin Chunkin. But there will be no Punkin Chunkin on TV ...

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
13 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Martin Rowe

Book Review: Controlling Radiated Emissions by Design
Martin Rowe
1 Comment
Controlling Radiated Emissions by Design, Third Edition, by Michel Mardiguian. Contributions by Donald L. Sweeney and Roger Swanberg. List price: $89.99 (e-book), $119 (hardcover).