Why are you tradingoff R&D project with startup. EUV is next generation lithography technique which might potentially replace 193-nm immersion lithography. I am sure companies are investing this technology inspite of heavy cost because they see potential in this technology.
EUV investment is similar to investment in TSV or SOI technology. How or whether it will be used is complete uncertainty. Timing is most important. Some companies don't even have 193 nm. Sometimes it seems they outsmart by waiting for a cheap solution for 15 nm and below. The last laugh will belong to whom?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.