Why are you tradingoff R&D project with startup. EUV is next generation lithography technique which might potentially replace 193-nm immersion lithography. I am sure companies are investing this technology inspite of heavy cost because they see potential in this technology.
EUV investment is similar to investment in TSV or SOI technology. How or whether it will be used is complete uncertainty. Timing is most important. Some companies don't even have 193 nm. Sometimes it seems they outsmart by waiting for a cheap solution for 15 nm and below. The last laugh will belong to whom?
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.