Guys, i agree with oldness of story but we shouldnt forget, author has right, now its not the case that R&D fellows at end companies sit in the lab and dig for best compatible product with help of booklets, technical spec. texts etc. If we just check out carrier pages of semi companies, there are many newly named positions else than regular ones(FAE,FSE), now we have PSM, PME etc. As a semi company you should know by heart where your product will be used, how u can make it different than others where design-ins are on. Even if the customer is unwilling to include your engineer for support, you should be able to understand needs perfectly.
For Sup.Cha. i totally agree with author, how many semi.companies are running their own sup.chain? We still have distis in between. Still in case of shortage times customers are getting in trouble cause of distis greediness and semi.cos unwillingness for punctual outcome, just check out what happenned at 2010.
There are 2 types of end-customers at todays electronic market! 1s, who are involved in design of their high-end chips as like apple, sony, samsung, high capacity of R&D and budget to run many projects simultaneously. This type of customers are directing semi co.s for their needs. There isnt such need for highlevel of product&design support. Others who has R&D but in need of gudiance and support while design ins are in place.
This is fact, future's brilliant semi.cos wont deal with production facilities, neither there wont be so many foundries to lead shrinkage of chips. JVs, Team-Ups will be more and more common. Perhaps we wont see lots of SoCs or product precific chips. Usage of same chip with different application is beyond dispute, just check inside of apple's new product family.
I have a guess about future business model of semicon. industry. The winner of ARM vs. Intel battle will shape the next. What do u think?
Hmmm, this is very old story, I agree with @VincePG...I worked in the IC design space for several years and it was always about end customers not chips...on some occasions we would even contact customers of our customers to make sure we understand final product use...and complex reference design, drivers etc was part of the sale process over 10 years ago...Kris
This was news about 15 years ago. Complex chips have been sold with ever more complex reference design and system level software requirements for quite some time. It has now become so complex that if you do not have a system level partner to work the system integration angle you will never get designed in.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.