Breaking News
Comments
Newest First | Oldest First | Threaded View
Page 1 / 2   >   >>
docdivakar
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
docdivakar   11/30/2010 11:44:54 PM
NO RATINGS
Most of the discussions are centered around the high cost of migrating to newer technology nodes and the ensuing high cost of equipment, hence consolidation. But the industry is also seeing an evolution of sorts with 3D chips stacking using older technology nodes. So isn't there a potential for new tools albeit lesser expensive that can give a leg up to the smaller companies to stay afloat without getting consolidated? It seems to me that the talk of consolidation is a bit premature for across the board but will happen in select segments. Dr. MP Divakar

yalanand
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
yalanand   11/29/2010 5:53:51 AM
NO RATINGS
Its all about streamlining your effort. If they feel lot of energy and money is being wasted in FAB research and they just want to concentrate on the design part what is wrong. I would call it disciple rather than self-imposed strangulation.

Charles.Desassure
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
Charles.Desassure   11/28/2010 5:09:52 PM
NO RATINGS
Thanks for this article. Yes, you are correct. For years IBM has been a beacon of research in semiconductor technology. I recall reading an article about this project years ago. I hope they are making better progress.

daleste
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
daleste   11/27/2010 1:54:45 AM
NO RATINGS
I agree with your analysis. It will be very difficult for some companies because the foundaries tend to be aligned with specific companies. TSMC is the only that is not.

kingmouf
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
kingmouf   11/26/2010 9:29:02 AM
NO RATINGS
At the moment, the concept of consolidating costs and moving to fab-lite or fabless seems very reasonable. However, I believe that there is a point when the narrowing of options will cause problems for a lot of companies - especially the ones that require the latest and most advanced nodes. As I can see, there are at the moment two advanced options for foundries: TSMC and GlobalFoundries. Samsung will likely become a third option (and could Intel become a fourth? I'm not so sure about that but let's consider it). Suppose there is a company like nVidia. It can not manufacture at Intel nor GlobalFoundries for competitive reasons. As it is pursuing more and more the embedded market with the Tegra lines, maybe it will be hard for nVidia to manufacture its chips at a direct competitor Samsung. So, it practically has only one option - TSMC. If the latter screws a process (and we know how probable this is) it has a serious problem if at least one of its competitors can manage to manufacture to a different facility which does not face these problems. Increasingly there will be other companies in a similar position.

FH1
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
FH1   11/26/2010 12:33:49 AM
NO RATINGS
Why not cut down on R&D as well ... that would save a whole bunch of money too! Sorry but cutting expenses like these doesn't grow your business ... it's a long slow death by self-imposed strangulation.

FH1
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
FH1   11/26/2010 12:30:49 AM
NO RATINGS
I suspect TSMC knows this too :-)

FH1
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
FH1   11/26/2010 12:29:13 AM
NO RATINGS
That's 2 very big 'ifs'. At 22nm and below, second sourcing will be history - transistor variability and ever-more complex DFM will take care of that - and leading-edge capacity, always tight, will be run even more leaner by the foundries (assuming there will be more than one 'real' choice) anxious to run in under rather than over capacity mode. Hey ho!

sranje
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
sranje   11/25/2010 7:20:00 PM
NO RATINGS
Peter, that is really an old news - we both know that. IBM is a system and R&D/Engineering services company and usually a decade ahead of the rest of the industry in strategic directions, including with its asset-lite strategy. Its research is formidable and critical to, for example, GlobalFoundries' long-term viability. I was one of questining TSMC's prowess in research - versus its superb strengths in low cost manufacturing and customer service. However, recently I was impressed by breakthrough credit to TSMC by Dr. Kelin J Kuhn, Intel Fellow, Director of Advanced Device Technology, Portland Technology Development. She led the development of 90nm, 45nm, 22nm and 15nm process technologies at Intel and is currently engaged in the development of the 11nm CMOS process technologies: "Recently, TSMC found a method to overcome a technical problem related to fin FETs, which I have been concerning about for a long time. It developed a technology to apply strong strain to the channel of fin FET. This is a major advance toward commercial production of fin FETs." Of course, we can be sure that both Intel and IBM are deep in the "post-silicon" IC research... Boris @ Petrov Group

KB3001
User Rank
Author
re: Is IBM moving to fab-lite, research heavy?
KB3001   11/25/2010 6:26:10 AM
NO RATINGS
I guess the article points to the shifting of power towards Foundries, which through consolidation can absorb the spiralling costs of fabs.

Page 1 / 2   >   >>


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
The quality and reliability of Mill-Max's two-piece ...
01:34
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...