@Charles.Desassure: I agree, I did not find anything that we don't know already about PCM & PRAMs available in public domain.
The thermal cross talk is a problem in both 2D and 3D applications, the latter being the worse. The thermal coupling through the substrate between junctions. Thinning the substrates and insulating layers may mitigate this to some extent but that is a change for the worse in 3D stacking.
@iniewski: I hear you, I don't see how PCM can scale better than flash; heating chalcogenide will put space restrictions on scaling. The alternative is worse, if switching rates are needed less than 5ns, there is a real possibility of thermal avalanche mode with scaling.
If IBM is 3 to 5 years away from commercializing this technology, they sure have their work cut out for them. Samsung may beat them to the punch!
Dr. MP Divakar
It's an interesting question. The crosstalk can be considered just from two adjacent pillars/stacks (same plane), with one having current through it. But I agree that 3D stacking (is that what you mean?) potentially could be more severe.
Thanks for this article. I have read this article over and over again and I am still wondering why Peter Clarke interviewed Jai Menon? Jai Menon is not saying anything that we don’t already know. We know that IBM is working on different projects. We need to ask IBM hard-hitting questions so we can know what they are during and where they are going? When a company is talking about three to five years on a project, to me; that sounds like you have more research to do and that is not "very bullish". But I am happy that Jai Menon is working on this exciting project.
I remain being skeptical here, I just don't see PCM scaling better than flash...working in a semiconductor industry for several years I have seen hundreds of cases when the company publicly talks about one technology but quietly pursues something different internally...Kris
Interesting. So it took 10 years for Micron to publicly admit in 2004 that PCM does not scale, after having signed an exclusive, royalty-bearing license to the phase-change memory patents in 1994. Then it took 10 years for Intel/STM/Numomyx to admit that PCM does not scale (a tacit admission, by failure to deliver the promised 45-nm chip in the beginning of this year). Samsung, having failed to produce the promised cell phone with phase-change memory by June 30 this year, should be next.
So, when will IBM admit that PCM does not scale? Looks like, in 2015, 10 years after that ill-fated "joint research initiative to explore the potential of a new form of computer memory technology called phase-change memory."
You can't make this up. And somebody at IBM is DEFINITELY not doing his/her job.
Mainly because I was asking Jai Menon about phase-change memory in the light of his recent reported comments (see foot of article).
Menon did say that IBM thinks magnetic "race-track" memory could be successfully a bit further out.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.