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re: Applied rolls fast, 'intelligent' etcher
docdivakar   12/6/2010 6:20:06 PM
@MarkLaPedus: it would be nice to know the throughput you mention (up to process up to 180 wafers an hour) is also valid for high aspect ratio TSV applications. Perhaps the eight process chambers for TSV applications might just as well make it a reality. AS a proponent of 3D via TSV technology, I welcome this introduction to reduce cost per wafer. How ever, it would also be nice to know the limitations of the etch process using this tool for TSV's. Dr. MP Divakar

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re: Applied rolls fast, 'intelligent' etcher
ChrisGammell   11/30/2010 9:33:23 PM
And yet still no announcements about 450mm wafers. Not surprising how hard it is to get uniform across 300mm, let alone adding even more real estate to etch. I'm looking forward to hearing how they'll tackle 450mm.

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re: Applied rolls fast, 'intelligent' etcher
daleste   11/29/2010 11:47:51 PM
It is good to see advancements in tool technology. We will need more advancements in this area to control process costs and turn times in the future.

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