@MarkLaPedus: it would be nice to know the throughput you mention (up to process up to 180 wafers an hour) is also valid for high aspect ratio TSV applications. Perhaps the eight process chambers for TSV applications might just as well make it a reality.
AS a proponent of 3D via TSV technology, I welcome this introduction to reduce cost per wafer. How ever, it would also be nice to know the limitations of the etch process using this tool for TSV's.
Dr. MP Divakar
And yet still no announcements about 450mm wafers. Not surprising how hard it is to get uniform across 300mm, let alone adding even more real estate to etch. I'm looking forward to hearing how they'll tackle 450mm.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.