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re: Intel, Micron tip air-gap in NAND
resistion   12/8/2010 5:38:31 AM
Hard to consider a boon to scaling, with the airgap being an extra space, so to speak.

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re: Intel, Micron tip air-gap in NAND
mike655mm   12/8/2010 2:01:55 AM
Yes, that's right. I was at DEC in the late '80s and we were evaluating whether or not to use 4K GaAs Srams from GigaBit Logic in a new mainframe being designed. They used air bridges in their process to reduce the line capacitance.

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re: Intel, Micron tip air-gap in NAND
Gary.Johnson_#13   12/8/2010 12:55:44 AM
Airgaps aren't really new. TriQuint used air gaps in their GaAs process in the mid 90's. It not at the scale Intel is talking about, but the structure was an airgap.

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re: Intel, Micron tip air-gap in NAND
GREATTerry   12/7/2010 1:19:31 PM
Nice to see new technology to further improve the process with smaller geometry.

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re: Intel, Micron tip air-gap in NAND
yalanand   12/7/2010 6:59:36 AM
How do they control the this structural bending ?

In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
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