Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 2
brightfiber
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
brightfiber   12/9/2010 7:20:53 PM
NO RATINGS
I have watched the fortunes of the semiconductor manufacturers improve with wafer size while their support vendors have been on a sort of increasing financial diet. US mask vendors in particular were beggered by playing vendors against one another leaving none with the funding levels for R&D that the semiconductor houses enjoyed. The result was predictable. In the 150/200mm transition, efficiency and yield improved for the fabs while the tool vendors found themselves selling fewer tools with which to cover their development costs. They learned the lesson. As long as there is sufficient financial incentive for S/C tool and support vendors to thrive, rather than just survive, then 450mm will happen in a timely fashion. Otherwise vendors will predictably drag their feet until the semiconductor companies come forward to share in the expense of the requisite R&D funding. Several years ago, a major customer requested us to gear up a fab in advance for the the production of their new device still in design. It was an expensive request with a lot of risk if they did not follow through with the orders. A clever gentleman within our organization struck an agreement where the customer would buy all the required expansion equipment which we would install then build the devices for them at an adjusted price. If the customer had defaulted, we were protected and they were out a significant sum. Hard investment dollars by the customer(s) is best grease to get things unstuck.

geekmaster
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
geekmaster   12/9/2010 5:56:36 PM
NO RATINGS
450mm would be about 2 years earlier but the economic downturn slowed everything down and pushed out any 450mm plans. This is now mainly a question of money. The equipment suppliers paid mainly the prize for the 300mm transition which began back in 1996 to 2000. Who is paying now? Well the ones who have the money: Intel, TSMC, Samsung, maybe two more. This will trigger a domino effect which means more companies feel encouraged to jump on the train. However, these fabs and tools will be very expensive, so I see JVs and Alliance first.

Neo10
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
Neo10   12/9/2010 8:52:39 AM
NO RATINGS
I have a little doubt- wouldn't moving to larger and larger die areas constitute a risk of higher variance in silicon properties on the same die?

Mike Cooke
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
Mike Cooke   12/9/2010 8:50:45 AM
NO RATINGS
There's certainly European activity on wafers and equipment readiness. Take a look at http://www.eemi450.net/

KB3001
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
KB3001   12/8/2010 11:38:52 PM
NO RATINGS
There is a riska attached to it though as the investments involved are in the billions. Only Intel, Samsung, TSMC and perhaps GF can afford it.

dnenni
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
dnenni   12/8/2010 11:24:32 PM
NO RATINGS
I did a blog on the 450mm Semiconductor Manufacturing Debate, which was based on one of the longest LinkedIn debates I have seen. . http://danielnenni.com/2010/05/23/450mm-semiconductor-manufacturing-debate/ 450mm will happen, believe it!

<<   <   Page 2 / 2


Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Most Recent Comments
VicVat
 
VicVat
 
fragro
 
Max The Magnificent
 
Max The Magnificent
 
dt_hayden
 
Rick_Hille
 
Max The Magnificent
 
dt_hayden
Like Us on Facebook
Special Video Section
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...