Breaking News
Comments
Newest First | Oldest First | Threaded View
Page 1 / 2   >   >>
wilber_xbox
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
wilber_xbox   12/24/2010 1:01:03 AM
NO RATINGS
i somehow missed this report. This is really something which was more like a rumor to save cost at 20x and 10x nodes.

Baolt
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
Baolt   12/24/2010 12:41:18 AM
NO RATINGS
As expected its on now, and not the nikon is the supplier for the fabtool. Its kind of combination from applied, asml and nikon last. As nikon had serious problems with extreme litho its was the reason why intel initially announced different than expected. No matter who says what, as the leader is in, every other big guy will follow him, so 450 is in place. However i dont think we could see 450 with sub-14nm as litho gets mad, and materials goes crazy. I wonder when 3D chip sets will be in place.

resistion
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
resistion   12/11/2010 5:57:15 PM
NO RATINGS
450 mm and sub-10 nm node are appropriately relegated to unimaginable future.

Bruzzer
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
Bruzzer   12/11/2010 6:01:19 AM
NO RATINGS
On collaboration to cut design and manufacturing costs certainly. On economics, Moore’s objective has presented an issue sub micron and all the time. Should industry double transistor density every 18 to 24 months on a pressed lithography schedule’s economics? Acknowledging Rock’s insight of doubling investment dollars each process generation has die economics become a fallacy? Where Intel has raced lithography inorganically how many nodes ahead to achieve its own process gains and too who’s benefit? When producing sequential short runs of surplus offer’s no economic profit too pay for this inefficiency over the long run? Too support producers or enablers of these subordinate economic effects? And now on trailing edge of CMOS average cost curve should development dollars be invested toward deflationary production scenarios on inflationary cost structures? Does 300mm+ acknowledge transition from industrial commercial art back towards applied science? Too bridge across a monopoly divide in development dollars toward all of our molecular futures? Meaning lithography, materials and etch but not harvesting on larger wafers. A monopoly aim whose time has past? Where competitors in this race have recognized their math error? Finally, IDM and end markets should pay more for this leading performance hardware enablement not less. Mike Bruzzone, Camp Marketing Consultancy

geekmaster
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
geekmaster   12/10/2010 11:53:55 PM
NO RATINGS
I do not think we will be using Poly-Si after 450mm.

mcgrathdylan
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
mcgrathdylan   12/10/2010 6:33:54 PM
NO RATINGS
PS- I was being facetious above. It sounds like there has been more progress on 450-mm than I realized. I'm still not convinced that 450 will be in production anytime soon, or that it will ever have mass appeal, even for the handful of companies that can afford it. But time will tell.

mcgrathdylan
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
mcgrathdylan   12/10/2010 6:30:19 PM
NO RATINGS
I think the industry should start development of 725-mm.....

yalanand
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
yalanand   12/10/2010 4:56:16 PM
NO RATINGS
Nice blog Daniel, Very informative. your dogs look scary :).

yalanand
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
yalanand   12/10/2010 4:47:36 PM
NO RATINGS
Ok so finally 450mm is here, any guesses what next ?

mlvlvr
User Rank
Author
re: Update: Intel confirms 450-mm fab plans
mlvlvr   12/9/2010 11:32:27 PM
NO RATINGS
more time passed between 300mm and whatevercomesnextmm, than between any two wafer size introductions in history. That's because it was so good at what it sought to do; reduce chip cost. Along the way, we also cut global warming gases per chip and made many other improvements.

Page 1 / 2   >   >>


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...
The LT®3042 is a high performance low dropout linear ...