As expected its on now, and not the nikon is the supplier for the fabtool. Its kind of combination from applied, asml and nikon last. As nikon had serious problems with extreme litho its was the reason why intel initially announced different than expected.
No matter who says what, as the leader is in, every other big guy will follow him, so 450 is in place. However i dont think we could see 450 with sub-14nm as litho gets mad, and materials goes crazy. I wonder when 3D chip sets will be in place.
On collaboration to cut design and manufacturing costs certainly. On economics, Moore’s objective has presented an issue sub micron and all the time. Should industry double transistor density every 18 to 24 months on a pressed lithography schedule’s economics? Acknowledging Rock’s insight of doubling investment dollars each process generation has die economics become a fallacy? Where Intel has raced lithography inorganically how many nodes ahead to achieve its own process gains and too who’s benefit? When producing sequential short runs of surplus offer’s no economic profit too pay for this inefficiency over the long run? Too support producers or enablers of these subordinate economic effects? And now on trailing edge of CMOS average cost curve should development dollars be invested toward deflationary production scenarios on inflationary cost structures? Does 300mm+ acknowledge transition from industrial commercial art back towards applied science? Too bridge across a monopoly divide in development dollars toward all of our molecular futures? Meaning lithography, materials and etch but not harvesting on larger wafers. A monopoly aim whose time has past? Where competitors in this race have recognized their math error? Finally, IDM and end markets should pay more for this leading performance hardware enablement not less. Mike Bruzzone, Camp Marketing Consultancy
PS- I was being facetious above. It sounds like there has been more progress on 450-mm than I realized. I'm still not convinced that 450 will be in production anytime soon, or that it will ever have mass appeal, even for the handful of companies that can afford it. But time will tell.
more time passed between 300mm and whatevercomesnextmm, than between any two wafer size introductions in history. That's because it was so good at what it sought to do; reduce chip cost. Along the way, we also cut global warming gases per chip and made many other improvements.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.