Breaking News
Comments
Newest First | Oldest First | Threaded View
old account Frank Eory
User Rank
Author
re: The case for stand-alone reset timers in mobile devices
old account Frank Eory   12/22/2010 8:08:18 PM
NO RATINGS
Doesn't every PMIC include a robust, software-proof watchdog timer reset function? Do some mobile handset designers really allocate PCB space for a separate watchdog IC? Why?

Forma
User Rank
Author
re: The case for stand-alone reset timers in mobile devices
Forma   12/22/2010 5:04:36 PM
NO RATINGS
The concept isn't new - there are already reset/watchdog ic chips often used in such designs. They allow communication with the Application processor to set-up a timer, whilst also providing protection for the SoC by holding the reset until the power is stable. It's know for years so above sounds more like a reminder than 'innovation'..

Andrewier
User Rank
Author
re: The case for stand-alone reset timers in mobile devices
Andrewier   12/21/2010 12:57:20 AM
NO RATINGS
Ahnnnn... A real (I mean not software) switch, anyone? After some really strong design and debuging, of course.

Code Monkey
User Rank
Author
re: The case for stand-alone reset timers in mobile devices
Code Monkey   12/20/2010 4:28:57 PM
NO RATINGS
The last handheld device I worked on had an FPGA. Software was expected to detect the "power" button after 3 seconds to provide the usual graceful shutdown, but for safety we put in logic to shut off power if the user holds down the button for more than 5 seconds. It's hard to imagine phone designers leaving out such a failsafe feature. Especially since Microsoft has conditioned users to expect a "reset button".

sharps_eng
User Rank
Author
re: The case for stand-alone reset timers in mobile devices
sharps_eng   12/11/2010 11:17:06 PM
NO RATINGS
I always scroll to the last page to check the writer's byline: ahah, its a Fairchild guy selling chips. Fair enough, but some of his fixit examples are just fixing terribly bad design in the original smartphones, ie the white screen of death; having to remove the battery... seems they never learn. I hereby declare that my preference is for a separate watchdog device, but I'd use an on-chip device provided it was independent of everything except the power rails. (I am assuming we are not talking about hi-rel devices here by the way.)



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Most Recent Comments
michigan0
 
SteveHarris0
 
realjjj
 
SteveHarris0
 
SteveHarris0
 
VicVat
 
Les_Slater
 
SSDWEM
 
witeken
Most Recent Messages
9/25/2016
4:48:30 PM
michigan0 Sang Kim First, 28nm bulk is in volume manufacturing for several years by the major semiconductor companies but not 28nm FDSOI today yet. Why not? Simply because unlike 28nm bulk the LDD(Lightly Doped Drain) to minimize hot carrier generation can't be implemented in 28nm FDSOI. Furthermore, hot carrier reliability becomes worse with scaling, That is the major reason why 28nm FDSOI is not manufacturable today and will not be. Second, how can you suppress the leakage currents from such ultra short 7nm due to the short channel effects? How thin SOI thickness is required to prevent punch-through of un-dopped 7nm FDSOI? Possibly less than 4nm. Depositing such an ultra thin film less then 4nm filum uniformly and reliably over 12" wafers at the manufacturing line is extremely difficult or not even manufacturable. If not manufacturable, the 7nm FDSOI debate is over!Third, what happens when hot carriers are generated near the drain at normal operation of 7nm FDSOI? Electrons go to the positively biased drain with no harm but where the holes to go? The holes can't go to the substrate because of the thin BOX layer. Some holes may become trapped at the BOX layer causing Vt shift. However, the vast majority of holes drift through the the un-dopped SOI channel toward the N+Source,...
Like Us on Facebook
Special Video Section
Once the base layer of a design has been taped out, making ...
In this short video we show an LED light demo to ...
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
02:46
Wireless Power enables applications where it is difficult ...
07:41
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...