Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
Patk0317
User Rank
Author
re: 3-D chips moving out of 'PowerPoint' era
Patk0317   12/12/2010 12:10:55 PM
NO RATINGS
I attended Ivo Bolsens keynote at FPT in Beijing where he described the Xilinx TSV technology. Sounds very promising and very real. This will allow massive SOCs to be realized in programmable logic.

Don Scansen
User Rank
Author
re: 3-D chips moving out of 'PowerPoint' era
Don Scansen   12/10/2010 4:23:42 PM
NO RATINGS
This "PowerPoint" analysis is great. I think it's better than my Dew Point analogy that I have been working with at my blog. Dylan's point is so true. I think I have been through that Monday morning slide deck myself. So many things seem to begin and end in the Microsoft software. Whether it's collecting thoughts, planning a strategy or actually communicating the message in the end, it's often "Death by PowerPoint." Engineers and others who tire of this, but may need to use the software and the medium for real purposes should check out an excellent presentation by that title on SlideShare. Just Google that title. Hey, it isn't going to get anyone over the vaporware hump, but better presentations might reduce the market for anti-depressants. And that makes me wonder if anyone has compared the related effectiveness or cost-benefit comparison of water-boarding versus PowerPoint.

kdboyce
User Rank
Author
re: 3-D chips moving out of 'PowerPoint' era
kdboyce   12/10/2010 6:35:24 AM
NO RATINGS
A similar joke is to tell a customer we will put our best Powerpoint engineer on the job. That aside, regardless of the interconnect between the layers, each layer will generate some heat. The TSV's and the programmable anti-fuses of NuPGA (http://nupga.com/images/NuPGA_3D-FPGA_100129.pdf) will have to conduct the heat to the base wafer, and also the top wafer (assuming a heatsink contact there). Otherwise, one is restricted to very low power devices. While there is clearly products that can benefit from the approach, the holy grail would be to put any function block anywhere necessary in a 3-D structure, truly building a system in a block. Nothing says the individual wafers have to be the same process so long as the inter-connects do their signal and heat transfer functions. Oh...and those darn I/O leads. Yeah...we gotta get them to the outside world too.

mcgrathdylan
User Rank
Author
re: 3-D chips moving out of 'PowerPoint' era
mcgrathdylan   12/10/2010 6:11:24 AM
NO RATINGS
Frank, I like that one. Good joke. I would also point out that we all know some people who are so accustomed to using Powerpoint as a crutch and talking through slides that I bet if you asked them about their weekend they'd just as soon answer by walking you through a deck.

old account Frank Eory
User Rank
Author
re: 3-D chips moving out of 'PowerPoint' era
old account Frank Eory   12/10/2010 6:02:52 AM
NO RATINGS
It's great to see that 3D TSV is making progress, despite the fact that "Powerpoint engineering" is rampant in many realms of our industry -- not only 3D TSVs. Just ask any marketer what the customer wants for his next SoC, and you can have beautiful Powerpoint slides within a week, showing the finished product as he or she envisions it, as if it were already in mass production. Back when I used to spend some effort on system to silicon design methodologies, we used to joke about the next phase being Powerpoint-to-silicon design methodologies. It's still a joke, but still there are some people who don't get that.



Radio
NEXT UPCOMING BROADCAST
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
Flash Poll
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
The LT®3042 is a high performance low dropout linear ...
Chwan-Jye Foo (C.J Foo), product marketing manager for ...
The LT®3752/LT3752-1 are current mode PWM controllers ...
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...