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nicolas.mokhoff
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re: Startup outlines monolithic 3-D chips
nicolas.mokhoff   12/11/2010 5:36:59 PM
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kdboyce: I could not agree more. It's a far cry from paper designs and simulations to practice runs. Wishing Or-Bach the best with his ideas turning into products. But the only way to so is to present the original idea in forums like this to get others to think "outside the box".

3D Guy
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re: Startup outlines monolithic 3-D chips
3D Guy   12/11/2010 3:13:17 AM
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The biggest markets for semiconductors 5-10 years from now will be portable electronic devices like cell phones, smart phones and tablet computers. Logic chips used for these markets burn very little power and in fact are 3D stacked today with wire-bonding to save space. Heat removal is far less of an issue with these low power chips. I predict that 3D will take off in a big way due to these huge markets and their lower susceptibility to heat removal issues.

3D Guy
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re: Startup outlines monolithic 3-D chips
3D Guy   12/11/2010 3:12:17 AM
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The biggest markets for semiconductors 5-10 years from now will be portable electronic devices like cell phones, smart phones and tablet computers. Logic chips used for these markets burn very little power and in fact are 3D stacked today with wire-bonding to save space. Heat removal is far less of an issue with these low power chips. I predict that 3D will take off in a big way due to these huge markets and their lower susceptibility to heat removal issues.

TravisOR
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re: Startup outlines monolithic 3-D chips
TravisOR   12/11/2010 12:43:40 AM
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If we consider one time read/write all cells of 1 Gb memory, then, most cells operates twice only while some logic runs billion times. Power consumption is proportional to frequency. Therefore, logic should be placed on silicon substrate for fast heat dissipation through bottom substrate. Memory cell on top of 3D IC will be fine even though dielectric layers have poor heat conduction because memory cells in general do not generate heat problem.

TravisOR
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re: Startup outlines monolithic 3-D chips
TravisOR   12/11/2010 12:28:47 AM
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Reduction of heat dissipation issue in TRUE 3D IC comes from product architecture which places slow functional blocks, such as memory cell array, on top and high speed logic including sense amplifier on the bottom substrate. This product architecture architecture scheme cannot be implemented with TSV because each memory cells on top should be accurately aligned to bottom logic within few nanometer misalignment. More information is available at http://www.besang.com. Check the video interview with Junil Park, VP of Technology at BeSang Inc.

R_Colin_Johnson
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re: Startup outlines monolithic 3-D chips
R_Colin_Johnson   12/10/2010 11:37:12 PM
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Yes, heat is a problem that is not going away--ever, according to Or-Bach, who claims its solution is the same as it always was. He claims that no new heat-sinking methods are needed, but rather that designers just have to learn how to manage heat in 3D!

pixies
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re: Startup outlines monolithic 3-D chips
pixies   12/10/2010 8:40:09 PM
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Well, if the layers are stacked 1,000 times closer, the heat, which already is a huge problem for stacked chip approach, will be even more of a headache.

R_Colin_Johnson
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re: Startup outlines monolithic 3-D chips
R_Colin_Johnson   12/10/2010 5:54:19 PM
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Yes, Or-Bach will speak about NuPGA's use of RCATs and a lot more about how true monolithic 3D could solve today's interconnection problems and also cut the heat they generate. He will also present his case for the many advantages of true monolithic 3D that I didn't mention, such as that each stacked chip is only 50-100 nanometers thick, compared to TSV stacked chips which are 50 microns thick, thus permitting many more chip layers to be stacked up using true monolithic 3D.

3D Guy
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re: Startup outlines monolithic 3-D chips
3D Guy   12/10/2010 3:03:06 PM
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Interesting article. The key point with this technology seems to be the use of manufacturing-friendly transistors such as RCATs that have been used in DRAM production (can see RCATs shown in figures above). Will make adoption easier.

kdboyce
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re: Startup outlines monolithic 3-D chips
kdboyce   12/10/2010 6:43:38 AM
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See my other comments at: http://www.eetimes.com/electronics-news/4211391/3-D-chips-moving-out-of--PowerPoint--era-

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