Don: a quick comment on air gaps. Since air has the lowest possible dielectric constant its use in silicon has been contemplated for several years to reduce parasitic capacitance. I believe the concept was first used by STM by introducing Silicon on Nothing (SON) technology for MOSFET. Others followed, there are a few patents on use of air gaps. I guess the challenge is on how to make them reliably and prevent anything (moisture?) getting inside them. But sealing silicon die seems easy to so where is the challenge? Anyone? Kris
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.