Don: a quick comment on air gaps. Since air has the lowest possible dielectric constant its use in silicon has been contemplated for several years to reduce parasitic capacitance. I believe the concept was first used by STM by introducing Silicon on Nothing (SON) technology for MOSFET. Others followed, there are a few patents on use of air gaps. I guess the challenge is on how to make them reliably and prevent anything (moisture?) getting inside them. But sealing silicon die seems easy to so where is the challenge? Anyone? Kris
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.