Don: a quick comment on air gaps. Since air has the lowest possible dielectric constant its use in silicon has been contemplated for several years to reduce parasitic capacitance. I believe the concept was first used by STM by introducing Silicon on Nothing (SON) technology for MOSFET. Others followed, there are a few patents on use of air gaps. I guess the challenge is on how to make them reliably and prevent anything (moisture?) getting inside them. But sealing silicon die seems easy to so where is the challenge? Anyone? Kris
Replay available now: A handful of emerging network technologies are competing to be the preferred wide-area connection for the Internet of Things. All claim lower costs and power use than cellular but none have wide deployment yet. Listen in as proponents of leading contenders make their case to be the metro or national IoT network of the future. Rick Merritt, EE Times Silicon Valley Bureau Chief, moderators this discussion. Join in and ask his guests questions.