@resistion: Micron is already late for the party, Samsung beat them to it with its RDIMM product:
I am sure there must be a couple of others who are either in the releasing stages of new TSV-based products or close to it.
A short tale before commenting on Durcan's view about the future of fabs.
'One day legendary Nasreddin Hodja went near lake with some yoghurt, where a fellow villager sees him putting yoghurt from the pot into the lake. He approaches in wonder and asks Hodja what he is trying to do and gets the answer:
“ I am yeasting yoghurt into the lake”.
Villager is really perplexed with this answer and tells Hodja with laugh that he cannot yeast the lake with yoghurt. Hodja gives a humorous and thought provoking answer:
“ What if it happens and all the lake turns into yoghurt?!”
For 450mm where your biggest competitor is arming himself for newest solution which is indeed risky but promising, about to define the rules of game, you cant simply say 'It has yet to be proven' if you think like that i am sorry but should be always behind the lead. At the game where pricing nd scaling is not just matters but crucial u have to join the bet.
Semiconductor history has nice stories if we dig a bit. Oh just one more thing, in order to be in the game u dont need to 're-tool' the entire company at all. Samsung, intel TSMC are not doing this momently.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.