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resistion
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re: Micron COO talks 450-mm, 3-D, EUV
resistion   1/12/2011 4:34:16 PM
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I remember, the stacked silicon layers cannot be grounded easily like usual silicon substrates.

resistion
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re: Micron COO talks 450-mm, 3-D, EUV
resistion   1/12/2011 3:47:28 PM
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If Micron's TSV is just for CMOS imaging, that's pretty weak. If they plan DRAM with TSVs that would lead to consideration of whether to make the whole stack in Taiwan (at Inotera).

resistion
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re: Micron COO talks 450-mm, 3-D, EUV
resistion   1/12/2011 3:42:39 PM
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Thanks docdivakar. I recall Samsung had something called S3 (stacked single-crystal Si) which they tried first on SRAM then NAND. Wonder what came of it, didn't hear about it before TSVs came along.

docdivakar
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re: Micron COO talks 450-mm, 3-D, EUV
docdivakar   1/11/2011 9:26:56 PM
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@resistion: Micron is already late for the party, Samsung beat them to it with its RDIMM product: http://www.eetimes.com/electronics-news/4211297/TSVs-help-Samsung-cut-DRAM-power-by-40- I am sure there must be a couple of others who are either in the releasing stages of new TSV-based products or close to it. MP Divakar

unknown multiplier
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re: Micron COO talks 450-mm, 3-D, EUV
unknown multiplier   1/11/2011 7:47:10 AM
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Did/will they license TSV to Nanya/Inotera?

resistion
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re: Micron COO talks 450-mm, 3-D, EUV
resistion   1/11/2011 5:20:02 AM
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It looks like they already at some stage with TSV. How this will develop is going to be interesting.

goafrit
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re: Micron COO talks 450-mm, 3-D, EUV
goafrit   1/11/2011 3:20:55 AM
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Interesting. Hope they come out competitive for a long time now.

will99878898
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re: Micron COO talks 450-mm, 3-D, EUV
will99878898   1/11/2011 1:00:26 AM
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Dude, the truth is intel is spending on 450mm, micron could just wait till it isall clear than buy/borrow from the big brother.

Baolt
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re: Micron COO talks 450-mm, 3-D, EUV
Baolt   1/10/2011 11:29:28 PM
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A short tale before commenting on Durcan's view about the future of fabs. 'One day legendary Nasreddin Hodja went near lake with some yoghurt, where a fellow villager sees him putting yoghurt from the pot into the lake. He approaches in wonder and asks Hodja what he is trying to do and gets the answer: “ I am yeasting yoghurt into the lake”. Villager is really perplexed with this answer and tells Hodja with laugh that he cannot yeast the lake with yoghurt. Hodja gives a humorous and thought provoking answer: “ What if it happens and all the lake turns into yoghurt?!” For 450mm where your biggest competitor is arming himself for newest solution which is indeed risky but promising, about to define the rules of game, you cant simply say 'It has yet to be proven' if you think like that i am sorry but should be always behind the lead. At the game where pricing nd scaling is not just matters but crucial u have to join the bet. Semiconductor history has nice stories if we dig a bit. Oh just one more thing, in order to be in the game u dont need to 're-tool' the entire company at all. Samsung, intel TSMC are not doing this momently.



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