Breaking News
Comments
Newest First | Oldest First | Threaded View
IFTLE
User Rank
Rookie
re: Volume driver spotted for 3-D TSVs
IFTLE   1/15/2011 2:50:58 PM
NO RATINGS
This is very old news. Memory on logic as the driver for 3DIC has been proposed for years. At Semicon Taiwan this past Sept there were several talks on this including Nokia who stated that JEDEC wide I/O standardization for 3DIC will be ready in late 2011. Contrary to the comments of Mokhoff and others, both Elpida and Samsung had now announced stacked memory products for 2011/2012. 3D is fully underway. To keep up with this on a weekly basis link to: http://www.electroiq.com/index/packaging/packaging-blogs/ap-blog-display/blogs/ap-blog.html

resistion
User Rank
CEO
re: Volume driver spotted for 3-D TSVs
resistion   1/14/2011 8:19:49 AM
NO RATINGS
@Abhijit.Deb: Doesn't the interposer use TSV?

Abhijit.Deb_#1
User Rank
Rookie
re: Volume driver spotted for 3-D TSVs
Abhijit.Deb_#1   1/14/2011 7:41:58 AM
NO RATINGS
Although the article does not say it explicitly, I assume the wide I/O DRAM is to be stacked on the logic die (SoC) of the mobile device. If we are considering a single layer of wide I/O memory being placed on top of a complex SoC, then we do not need TSV. There are cheaper technologies than TSV, for example, bump based 3D stacking. Alternatively, one can have a feed-through interposer (FTI), between the logic and memory dice, as discussed in the SMAFTI technology developed at NEC.

nicolas.mokhoff
User Rank
Rookie
re: Volume driver spotted for 3-D TSVs
nicolas.mokhoff   1/13/2011 3:11:05 PM
NO RATINGS
Last paragraph reiterates it all, about the issues of tools, complexity, integration and standards. It will take a monumental industry-wide effort to come up with feasible production line three-dimensional chips. And it needs design, process and production disciplines to come together to resolve various different approaches. The SIA/SRC collaboration and the SEMI efforts are only a starting point.

resistion
User Rank
CEO
re: Volume driver spotted for 3-D TSVs
resistion   1/13/2011 4:16:49 AM
NO RATINGS
Case in point: http://www.pcper.com/article.php?aid=1062

resistion
User Rank
CEO
re: Volume driver spotted for 3-D TSVs
resistion   1/13/2011 4:12:07 AM
NO RATINGS
DRAM may be a prime application, but its market is too weak to be a real enthusiastic driver until 2013.

greenpattern
User Rank
Rookie
re: Volume driver spotted for 3-D TSVs
greenpattern   1/13/2011 4:02:55 AM
NO RATINGS
DRAM packages still have thermal considerations. A TSV package will be much worse than conventional.



EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Aging Brass: Cow Poop vs. Horse Doo-Doo
Max Maxfield
40 comments
As you may recall, one of the things I want to do with the brass panels I'm using in my Inamorata Prognostication Engine is to make them look really old. Since everything is being mounted ...

EDN Staff

11 Summer Vacation Spots for Engineers
EDN Staff
11 comments
This collection of places from technology history, museums, and modern marvels is a roadmap for an engineering adventure that will take you around the world. Here are just a few spots ...

Glen Chenier

Engineers Solve Analog/Digital Problem, Invent Creative Expletives
Glen Chenier
11 comments
- An analog engineer and a digital engineer join forces, use their respective skills, and pull a few bunnies out of a hat to troubleshoot a system with which they are completely ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
45 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...

Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)