Breaking News
Comments
Newest First | Oldest First | Threaded View
IFTLE
User Rank
Author
re: Volume driver spotted for 3-D TSVs
IFTLE   1/15/2011 2:50:58 PM
NO RATINGS
This is very old news. Memory on logic as the driver for 3DIC has been proposed for years. At Semicon Taiwan this past Sept there were several talks on this including Nokia who stated that JEDEC wide I/O standardization for 3DIC will be ready in late 2011. Contrary to the comments of Mokhoff and others, both Elpida and Samsung had now announced stacked memory products for 2011/2012. 3D is fully underway. To keep up with this on a weekly basis link to: http://www.electroiq.com/index/packaging/packaging-blogs/ap-blog-display/blogs/ap-blog.html

resistion
User Rank
Author
re: Volume driver spotted for 3-D TSVs
resistion   1/14/2011 8:19:49 AM
NO RATINGS
@Abhijit.Deb: Doesn't the interposer use TSV?

Abhijit.Deb_#1
User Rank
Author
re: Volume driver spotted for 3-D TSVs
Abhijit.Deb_#1   1/14/2011 7:41:58 AM
NO RATINGS
Although the article does not say it explicitly, I assume the wide I/O DRAM is to be stacked on the logic die (SoC) of the mobile device. If we are considering a single layer of wide I/O memory being placed on top of a complex SoC, then we do not need TSV. There are cheaper technologies than TSV, for example, bump based 3D stacking. Alternatively, one can have a feed-through interposer (FTI), between the logic and memory dice, as discussed in the SMAFTI technology developed at NEC.

nicolas.mokhoff
User Rank
Author
re: Volume driver spotted for 3-D TSVs
nicolas.mokhoff   1/13/2011 3:11:05 PM
NO RATINGS
Last paragraph reiterates it all, about the issues of tools, complexity, integration and standards. It will take a monumental industry-wide effort to come up with feasible production line three-dimensional chips. And it needs design, process and production disciplines to come together to resolve various different approaches. The SIA/SRC collaboration and the SEMI efforts are only a starting point.

resistion
User Rank
Author
re: Volume driver spotted for 3-D TSVs
resistion   1/13/2011 4:16:49 AM
NO RATINGS
Case in point: http://www.pcper.com/article.php?aid=1062

resistion
User Rank
Author
re: Volume driver spotted for 3-D TSVs
resistion   1/13/2011 4:12:07 AM
NO RATINGS
DRAM may be a prime application, but its market is too weak to be a real enthusiastic driver until 2013.

greenpattern
User Rank
Author
re: Volume driver spotted for 3-D TSVs
greenpattern   1/13/2011 4:02:55 AM
NO RATINGS
DRAM packages still have thermal considerations. A TSV package will be much worse than conventional.



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
Special Video Section
Protecting sensitive electronic circuitry from voltage ...
09:45
Watch as a web server authenticates or rejects a water ...
Protecting sensitive electronic circuitry from voltage ...
Watch as a web server authenticates or rejects a water ...
Protecting sensitive electronic circuitry from voltage ...
Power can be a gating factor in success or failure of ...
Get to market faster and connect your next product to the ...
00:44
See how microQSFP is setting a new standard for tomorrow’s ...
The LTC3649 step-down regulator combines key features of a ...
Once the base layer of a design has been taped out, making ...
In this short video we show an LED light demo to ...
The LTC2380-24 is a versatile 24-bit SAR ADC that combines ...
In this short video we show an LED light demo to ...
02:46
Wireless Power enables applications where it is difficult ...
07:41
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27