Breaking News
Comments
Newest First | Oldest First | Threaded View
IFTLE
User Rank
Author
re: Volume driver spotted for 3-D TSVs
IFTLE   1/15/2011 2:50:58 PM
NO RATINGS
This is very old news. Memory on logic as the driver for 3DIC has been proposed for years. At Semicon Taiwan this past Sept there were several talks on this including Nokia who stated that JEDEC wide I/O standardization for 3DIC will be ready in late 2011. Contrary to the comments of Mokhoff and others, both Elpida and Samsung had now announced stacked memory products for 2011/2012. 3D is fully underway. To keep up with this on a weekly basis link to: http://www.electroiq.com/index/packaging/packaging-blogs/ap-blog-display/blogs/ap-blog.html

resistion
User Rank
Author
re: Volume driver spotted for 3-D TSVs
resistion   1/14/2011 8:19:49 AM
NO RATINGS
@Abhijit.Deb: Doesn't the interposer use TSV?

Abhijit.Deb_#1
User Rank
Author
re: Volume driver spotted for 3-D TSVs
Abhijit.Deb_#1   1/14/2011 7:41:58 AM
NO RATINGS
Although the article does not say it explicitly, I assume the wide I/O DRAM is to be stacked on the logic die (SoC) of the mobile device. If we are considering a single layer of wide I/O memory being placed on top of a complex SoC, then we do not need TSV. There are cheaper technologies than TSV, for example, bump based 3D stacking. Alternatively, one can have a feed-through interposer (FTI), between the logic and memory dice, as discussed in the SMAFTI technology developed at NEC.

nicolas.mokhoff
User Rank
Author
re: Volume driver spotted for 3-D TSVs
nicolas.mokhoff   1/13/2011 3:11:05 PM
NO RATINGS
Last paragraph reiterates it all, about the issues of tools, complexity, integration and standards. It will take a monumental industry-wide effort to come up with feasible production line three-dimensional chips. And it needs design, process and production disciplines to come together to resolve various different approaches. The SIA/SRC collaboration and the SEMI efforts are only a starting point.

resistion
User Rank
Author
re: Volume driver spotted for 3-D TSVs
resistion   1/13/2011 4:16:49 AM
NO RATINGS
Case in point: http://www.pcper.com/article.php?aid=1062

resistion
User Rank
Author
re: Volume driver spotted for 3-D TSVs
resistion   1/13/2011 4:12:07 AM
NO RATINGS
DRAM may be a prime application, but its market is too weak to be a real enthusiastic driver until 2013.

greenpattern
User Rank
Author
re: Volume driver spotted for 3-D TSVs
greenpattern   1/13/2011 4:02:55 AM
NO RATINGS
DRAM packages still have thermal considerations. A TSV package will be much worse than conventional.



Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...
The LT®3042 is a high performance low dropout linear ...
Chwan-Jye Foo (C.J Foo), product marketing manager for ...