NAND can't scale below the ONO thickness of 17-18 nm plus the silicon thickness of at least few nm. But that is where NAND is now. To go 3d to expand capacity has yield and ECC consequences which may offset the economic benefit.
I think, about a month back, we were discussing about the future of the NAND memories. Some believe that, the year 2011 is going to be the year of NAND memories. Is there any estimated time frame, by when the memories using newer technologies (such as MRAM, PCM etc.) are going to take place of the conventional memory technologies?
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.