Espresso 450 is an RF module that can be used in cell phones for implementing RF Section of the Cell Phone, this will be finding a very good applications in the small scale manufactures as it has got interface for Android.
The article is still wrong unfortunately. 700mm2 is the PCB footprint, not the packaging footprint! The platform includes a a 7x7 baseband, a 6x6 radio, and a PMIC with a very small wafer level package. That means the total packaging footprint is less than 100mm². That's a 3-chip solution whereas Infineon/ST-Ericsson have 2-chip solutions, but at least in Infineon's case that's just stacking the PMIC on the baseband which I fail to see how it would provide a cost benefit versus a WLP PMIC.
The remaining 600mm2 of PCB footprint is taken by power amplifiers, memory, and passive components. I honestly don't know why Icera even bothered providing that number because it's both slightly confusing (as Peter's misunderstanding highlights) and rarely comparable to anything else because you can optimise more for area at the detriment of cost or other metrics.
The Option GTM501 module with Icera's 65nm baseband and 130nm RF chip took only 750mm2, so with Espresso 450 and a similar level of area optimisation and DRAM stacking I wouldn't be surprised if 400mm2 was possible in theory.
Anyway the big news here is that Icera finally has a voice certified platform and they have reference platforms with multiple application processor vendors. The phrasing of the press release is rather vague, but I assume they're going to show ODM phones at MWC (that carriers will pick up and self-brand) and try to win more major phone OEMs. Let's wait and see how that goes...