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re: Air of promise filled DesignCon
kjdsfkjdshfkdshfvc   2/19/2011 5:55:35 AM
Was it just me, or did it seem like every LeCroy employee (including contracts and the janitors) were at the show? What was up with that?

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re: Air of promise filled DesignCon
Scope Guru   2/16/2011 10:57:42 PM
We likewise felt a good vibe from DesignCon this year. The crowds flocking to papers and panels related to jitter and de-embedding, with many sold out, was good to see. This reflects on a need to solve challenges that are beginning to emerge as our customers grapple with 8+ Gb/sec signaling on FR-4 circuit boards. From a signal integrity perspective, discussions revolved around accurate de-embedding practices and how to perform them with confidence. Questions/comments like; S Parameters from a Vector Network Analyzer or a Time Domain Reflectometry methodology? Where and how to take the measurement? What role does probing play? Do the models reflect reality? The industry is looking for direction – and found lots of it at DesignCon. At the Tektronix booth, our most popular displays and demos centered around Gen 3 serial standards like PCI Express 3.0 and 10G Ethernet. From the buzz and traffic, it’s clear that technology is advancing – along with the challenges. Chris Loberg, Tektronix

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re: Air of promise filled DesignCon
JanineLove   2/13/2011 7:37:15 PM
I asked Martin for this piece so he could share his impressions from the show floor. If you were at the show, please feel free to share your impressions as well in the comments section below.

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