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docdivakar
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re: Samsung CEO: Four challenges seen for ICs
docdivakar   2/28/2011 11:16:48 PM
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I would have phrased a 5th challenge for the IC's: it is the challenge of developing applications IC's (as opposed to application specific IC's) because of the obvious reason: the falling-off the cliff statistics for new ASIC starts! So the challenge is rather a hybrid of 1, 2 & 3: to design a low-cost application using today's and yesterday's technology for newer applications. I am sure we will begin to see a new breed of 'ASIC' companies that leverage this idea. MP Divakar

workfunction
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re: Samsung CEO: Four challenges seen for ICs
workfunction   2/27/2011 2:41:02 PM
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The recent numbers for FD SOI : cost and power consumption look interesting (put out by the SOI consortium and ARM). are they real?

Baolt
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re: Samsung CEO: Four challenges seen for ICs
Baolt   2/23/2011 11:58:04 PM
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Power consumption is one of the biggest problem of today's electronics no matter from which point u see. Telecommunication companies already started an innovation under Greentouch.org. Why not having similar thinking for chip vendors, producers, foundries.

yalanand
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re: Samsung CEO: Four challenges seen for ICs
yalanand   2/22/2011 2:41:17 AM
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"Samsung announced the development of a 1-Gbit DRAM with a 512-pin wide I/O interface intended for mobile applications" Wow, this is really good news. Does it mean that the mobile storage capability will go up significantly in near future ?



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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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