I am a bit surprised about this move by AMD, I thought their support of Global Foundries was unequivocal! But then again, cost rules! As an established top foundry player, TSMC has the leverage to offer attractive prices which may be hard to beat by an upstart like Global.
Global Foundries' tech forum last year was also big on other complementing technologies including 3D with TSV, MEMS, SOI, etc., not to mention a big part in memory market. Time will tell how they will do!
AMD is abandoning it's foundry ship! That's sad. Semi market really needs alternative to TSMC but AMS just can't wait too long before Intel eats them up.
Global management really needs to get their act together selling more than a powerpoint. Their sales execs need to get engaged with customers. Hope they can turn around!!
To me, this sounds more like a dual sourcing game to try and keep foundry costs low than a significant shift in orders. 28nm is not ahead of schedule. It is behind schedule by 6 to 9 months. There is not enough data yet to say whether yield is better than the problems that showed up at 40nm. The early data on 28nm suggests performance gains are mediocre, but power and area gains are decent.
Ontario and is the frequency difference between the two Zacate, TDP 9W one of a 18W, a small part of TW were extremely shameless to rely on false information to super stock.AMD 32nm and 28nm in the list will be the next GF. As for the AMD 40nm of the list, it is because the industry's only TSMC to play the tech node, it can currently only tsmc orders.
Industry revealed that 28 nanometer graphics chips AMD originally planned to transfer the global wafer orders, and later active collaboration between TSMC and AMD, so AMD adopted "double-OEM" sources. Southern Islands GPU first successful trial production at TSMC, TSMC 28 nm ahead of schedule shows. ...
Shameless guy said each said the industry and do not say who said it
Jiangshang Yi said that TSMC will skip 22 nm process, direct the development of 20 nanometer manufacturing process, into the third quarter of 2012, a large number of mass production in 2013, progress for the first time beyond the semiconductor leader Intel, TSMC scored in the advanced process development first in the world. --------- No sense of shame to the extreme, risk production in 2012, 2013, to volume production of advanced process development of the so-called 20NM scored first in the world. 2013, all production of the Intel 15NM
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.