Interestingly, no 16 nm node anymore. It became 15 and now 14 nm. It might even become 13 nm by production time. 20 nm is already fixed to double patterning with 193 nm immersion. It could extend one more node. Multiple patterning should be mainstream in 2012.
If TSMC has decided to use EUV at 16nm that means it's been proven cost effective in high volume. The negative of this is, the other technologies have not been proven, at least to TSMC's satisfaction. TSMC really knows high volume and their opinion is the way to bet.
its all okey but what about intel & samsung. It seems intel is not willing to be involved in EUV since its fully applicable either samsung. If they drag to spend money on EUV who will finance technology then? It seems double patterning is the only feasible solution till we reach below 20nm.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.