Breaking News
Comments
Newest First | Oldest First | Threaded View
mranderson
User Rank
Author
re: Panel reveals concerns over 450-mm wafer work
mranderson   3/7/2011 4:04:21 PM
NO RATINGS
I agree with your sentiment Kris. Europe has worried for over a decade than semiconductor manufacturing will leave and only be done in the U.S. and in Asia. Crolles was largely paid for by the French government to keep high tech industry in France. The odds are becoming higher that it will leave Europe if European governments do not provide funding. Intel has been seeking 450mm wafers for about a decade since its manufacturing is restricted by 300mm wafers. TSMC is also starting to come to the same conclusion as Intel. My own guess is we will see 450mm wafers in the next 5 to 8 years. 300mm wafers frankly would not be competitive compared to 450mm wafers at 40nm technology. The fabs can take a break from Moores Law somewhere below 20nm and gain efficiency and yield advantages with 450mm wafers. This will give lithography development some breathing room. Intel, TSMC, and Samsung will lead the way. It is in their interest to force this shift. Some additional fabs may eventually make the transition as well depending on funding sources.

daleste
User Rank
Author
re: Panel reveals concerns over 450-mm wafer work
daleste   3/6/2011 5:32:04 PM
NO RATINGS
The move to 450mm wafers is very expensive. For the captial cost to pay off, you have to run a lot of wafers. Only very large companies with deep pockets can do this. That is why the article states that this might cause the industry to collapse to only a few companies. As long as the smaller (12 inch is small?) wafer sizes can still compete on price, there is no worry of a collapse.

krisi
User Rank
Author
re: Panel reveals concerns over 450-mm wafer work
krisi   3/4/2011 9:27:11 PM
NO RATINGS
Interesting debate...I agree that if there are 3-4 players left after transition to 450-mm wavers Europe is in trouble...Intel will fab processors, Samsung memories, and TSMC/GlobalF the rest...Europe's fabs will all become boutique foundries unless they all pitch-in together and extra billions from European taxpayers somehow...Kris



Radio
LATEST ARCHIVED BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.

Brought to you by:

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Like Us on Facebook
Special Video Section
LEDs are being used in current luxury model automotive ...
With design sizes expected to increase by 5X through 2020, ...
01:48
Linear Technology’s LT8330 and LT8331, two Low Quiescent ...
The quality and reliability of Mill-Max's two-piece ...
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
Silego Technology’s highly versatile Mixed-signal GreenPAK ...
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...