Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 3   >   >>
resistion
User Rank
Author
re: Momentum builds for 3-D chips
resistion   4/5/2011 10:04:46 PM
NO RATINGS
TSV area penalty can be quite significant. 1000 on 0.1 mm pitch is already 10 sq. mm.

d_sekar
User Rank
Author
re: Momentum builds for 3-D chips
d_sekar   4/5/2011 5:39:58 AM
NO RATINGS
Actually, you can find detailed info for paths to monolithic 3D at this page: http://www.monolithic3d.com/paths-to-monolithic-3d.html. The benefits of monolithic 3D are significant, it can provide benefits equivalent to several generations of conventional scaling (more detailed info at http://www.monolithic3d.com/why-monolithic-3d.html). This is largely due to the small via sizes that allow on-chip interconnect lengths to be reduced. If you have more questions, please e-mail us at info@monolithic3d.com

greenpattern
User Rank
Author
re: Momentum builds for 3-D chips
greenpattern   4/5/2011 4:55:41 AM
NO RATINGS
3D stacking offers electrical proximity but thermal proximity comes along with it.

resistion
User Rank
Author
re: Momentum builds for 3-D chips
resistion   4/5/2011 4:50:16 AM
NO RATINGS
This is the most feasible scenario, but the irony is the more DRAM is used, the worse the performance/watt of the whole system.

3D Guy
User Rank
Author
re: Momentum builds for 3-D chips
3D Guy   4/5/2011 2:09:40 AM
NO RATINGS
Well, you can't expect a company website to have detailed technical info!

krisi
User Rank
Author
re: Momentum builds for 3-D chips
krisi   4/4/2011 11:11:45 PM
NO RATINGS
To @selinz, sure, stacking already happens but it is still very small portion of the overall IC shipment...power dissipation is and will be a major concern...maybe we should run some water pipes in between the silicon dice to coll things off...Kris

selinz
User Rank
Author
re: Momentum builds for 3-D chips
selinz   4/4/2011 8:05:21 PM
NO RATINGS
We're already seeing stacks in mobile products so to assume that this is all mumbo jumbo is absurd. And in a sense, this is wafer scale integration.... We're not talking about stacking 10 P7's on top of each other.

bkeller137
User Rank
Author
re: Momentum builds for 3-D chips
bkeller137   4/4/2011 7:55:10 PM
NO RATINGS
The most promising use of stacked die seems to be for memory on top of processor/logic chips. This could be to enable a huge cache for a CPU or, in the case of mobile devices where they don't use tens of GB of RAM, it could be all of main memory. Any design formerly considering multi-chip modules might now consider stacked die. Note that DRAM will consume less power and produce less heat if it sends the whole cache line in one cycle using TSVs instead of multiple cycles through off-chip drivers.

dirk.bruere
User Rank
Author
re: Momentum builds for 3-D chips
dirk.bruere   4/4/2011 7:20:08 PM
NO RATINGS
Whatever happened to wafer scale integration? I would have thought it easier than cutting and stacking

greenpattern
User Rank
Author
re: Momentum builds for 3-D chips
greenpattern   4/4/2011 4:32:05 AM
NO RATINGS
We don't bond servers together in a rack for a very good reason. Expect same for wafers.

<<   <   Page 2 / 3   >   >>


Radio
NEXT UPCOMING BROADCAST
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
Flash Poll
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
The LT®3042 is a high performance low dropout linear ...
Chwan-Jye Foo (C.J Foo), product marketing manager for ...
The LT®3752/LT3752-1 are current mode PWM controllers ...
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...