Breaking News
Comments
Newest First | Oldest First | Threaded View
<<   <   Page 2 / 3   >   >>
resistion
User Rank
CEO
re: Momentum builds for 3-D chips
resistion   4/5/2011 10:04:46 PM
NO RATINGS
TSV area penalty can be quite significant. 1000 on 0.1 mm pitch is already 10 sq. mm.

d_sekar
User Rank
Rookie
re: Momentum builds for 3-D chips
d_sekar   4/5/2011 5:39:58 AM
NO RATINGS
Actually, you can find detailed info for paths to monolithic 3D at this page: http://www.monolithic3d.com/paths-to-monolithic-3d.html. The benefits of monolithic 3D are significant, it can provide benefits equivalent to several generations of conventional scaling (more detailed info at http://www.monolithic3d.com/why-monolithic-3d.html). This is largely due to the small via sizes that allow on-chip interconnect lengths to be reduced. If you have more questions, please e-mail us at info@monolithic3d.com

greenpattern
User Rank
Rookie
re: Momentum builds for 3-D chips
greenpattern   4/5/2011 4:55:41 AM
NO RATINGS
3D stacking offers electrical proximity but thermal proximity comes along with it.

resistion
User Rank
CEO
re: Momentum builds for 3-D chips
resistion   4/5/2011 4:50:16 AM
NO RATINGS
This is the most feasible scenario, but the irony is the more DRAM is used, the worse the performance/watt of the whole system.

3D Guy
User Rank
Manager
re: Momentum builds for 3-D chips
3D Guy   4/5/2011 2:09:40 AM
NO RATINGS
Well, you can't expect a company website to have detailed technical info!

krisi
User Rank
CEO
re: Momentum builds for 3-D chips
krisi   4/4/2011 11:11:45 PM
NO RATINGS
To @selinz, sure, stacking already happens but it is still very small portion of the overall IC shipment...power dissipation is and will be a major concern...maybe we should run some water pipes in between the silicon dice to coll things off...Kris

selinz
User Rank
CEO
re: Momentum builds for 3-D chips
selinz   4/4/2011 8:05:21 PM
NO RATINGS
We're already seeing stacks in mobile products so to assume that this is all mumbo jumbo is absurd. And in a sense, this is wafer scale integration.... We're not talking about stacking 10 P7's on top of each other.

bkeller137
User Rank
Rookie
re: Momentum builds for 3-D chips
bkeller137   4/4/2011 7:55:10 PM
NO RATINGS
The most promising use of stacked die seems to be for memory on top of processor/logic chips. This could be to enable a huge cache for a CPU or, in the case of mobile devices where they don't use tens of GB of RAM, it could be all of main memory. Any design formerly considering multi-chip modules might now consider stacked die. Note that DRAM will consume less power and produce less heat if it sends the whole cache line in one cycle using TSVs instead of multiple cycles through off-chip drivers.

dirk.bruere
User Rank
Rookie
re: Momentum builds for 3-D chips
dirk.bruere   4/4/2011 7:20:08 PM
NO RATINGS
Whatever happened to wafer scale integration? I would have thought it easier than cutting and stacking

greenpattern
User Rank
Rookie
re: Momentum builds for 3-D chips
greenpattern   4/4/2011 4:32:05 AM
NO RATINGS
We don't bond servers together in a rack for a very good reason. Expect same for wafers.

<<   <   Page 2 / 3   >   >>


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

The Best of the Best Videos on YouTube
Max Maxfield
4 comments
A couple of days ago, my chum Paul was visiting me in my office. He'd wandered over from his cubicle in the next bay to take a brief coffee break. This week, Paul had been admiring the ...

Jolt Judges and Andrew Binstock

Jolt Awards: The Best Books
Jolt Judges and Andrew Binstock
1 Comment
As we do every year, Dr. Dobb's recognizes the best books of the last 12 months via the Jolt Awards -- our cycle of product awards given out every two months in each of six categories. No ...

Engineering Investigations

Air Conditioner Falls From Window, Still Works
Engineering Investigations
2 comments
It's autumn in New England. The leaves are turning to red, orange, and gold, my roses are in their second bloom, and it's time to remove the air conditioner from the window. On September ...

David Blaza

The Other Tesla
David Blaza
5 comments
I find myself going to Kickstarter and Indiegogo on a regular basis these days because they have become real innovation marketplaces. As far as I'm concerned, this is where a lot of cool ...