Breaking News
Comments
Oldest First | Newest First | Threaded View
Page 1 / 2   >   >>
resistion
User Rank
Author
re: Why is TSMC moving into 450-mm?
resistion   4/6/2011 8:22:20 PM
NO RATINGS
Fewer 450 mm fabs (half compared to 300 mm say) could be a hazard in terms of contingencies.

walken1
User Rank
Author
re: Why is TSMC moving into 450-mm?
walken1   4/6/2011 8:50:13 PM
NO RATINGS
I'm curious as to why TSMC feels that it will become more and more difficult to attract good engineers over time. If anything, I would think that the industry consolidation and job displacement currently underway is leading to a greater surplus of engineering talent. Or perhaps is TSMC taking the long view and seeing this trend driving fewer engineering students to enter the semiconductor field in the next wave/generation? Interested in any thoughts on the matter.

mark.lapedus
User Rank
Author
re: Why is TSMC moving into 450-mm?
mark.lapedus   4/6/2011 9:04:03 PM
NO RATINGS
TSMC believes fewer (good) engineers will enter the IC field.....

RobDinsmore
User Rank
Author
re: Why is TSMC moving into 450-mm?
RobDinsmore   4/6/2011 10:44:45 PM
NO RATINGS
That's a good point Mark. I recently entered the field myself after completing my Physics Ph.D. in '08. Maybe it was just timing, but 2 different senior engineers that I interviewed with both essentially asked why I wanted to enter a dying industry. The fab engineer job also can produce a very poor quality of life. In my experience, the really good ones leave for more fulfilling careers with greater upward mobility. Well at least that's what I did, albeit I am still working on process R&D.

Warren3
User Rank
Author
re: Why is TSMC moving into 450-mm?
Warren3   4/6/2011 10:47:59 PM
NO RATINGS
I don't see this putting TSMC ahead of Samsung.

goafrit
User Rank
Author
re: Why is TSMC moving into 450-mm?
goafrit   4/7/2011 1:00:56 PM
NO RATINGS
They must because Intel and others are moving there. That is the future but it will not be easy. It will not be.

krisi
User Rank
Author
re: Why is TSMC moving into 450-mm?
krisi   4/7/2011 5:05:40 PM
NO RATINGS
Rob, congrats, you have just entered dying industry!;-)...Kris

chipmonk0
User Rank
Author
re: Why is TSMC moving into 450-mm?
chipmonk0   4/7/2011 5:38:42 PM
NO RATINGS
At the Symposium TSMC said that over the last 5 years they have boosted the number of process R&D engineers by 3x !! Perhaps they have finally run out of Chinese speaking Process Engr.s trained in the US and this claim of requiring fewer Engr.s as an argument for going to 450 mm is plain wishful thinking. Maintaining process uniformity over a larger wafer is never a trivial challenge and transition from 300 to 450 mm too will also require a lot of engineering resources - even if modeling etc. will help a lot more in chamber design etc.

docdivakar
User Rank
Author
re: Why is TSMC moving into 450-mm?
docdivakar   4/7/2011 6:40:47 PM
NO RATINGS
450mm makes sense to go to commoditized products like memory and cheap logic but creates one hell of a problem in wafer handling, especially when there is Wafer to Wafer stacking involved. But then again, TSMC said they are going to expand their packaging & test efforts, may be they are on to something that gives them an edge in this 450mm business overall. MP Divakar

changjm
User Rank
Author
re: Why is TSMC moving into 450-mm?
changjm   10/30/2011 8:10:25 AM
NO RATINGS
We are equipment vendors to do our best to maintain the equipment and improve the process for TSMC. I think fewer engineers or operators doesn't represent the fewer people working in the fab because it will still need more professional vendors to maintain the complicated tools or improve the process in the fab because new generation machines are more complicated and expensive. Of course many professional people inside the fab without any contingencies.

Page 1 / 2   >   >>


Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Radio
NEXT UPCOMING BROADCAST

What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.
Like Us on Facebook
Special Video Section
LED lighting is an important feature in today’s and future ...
05:27
The LT8602 has two high voltage buck regulators with an ...
05:18
The quality and reliability of Mill-Max's two-piece ...
01:34
Why the multicopter? It has every thing in it. 58 of ...
Security is important in all parts of the IoT chain, ...
Infineon explains their philosophy and why the multicopter ...
The LTC4282 Hot SwapTM controller allows a board to be ...
This video highlights the Zynq® UltraScale+™ MPSoC, and sho...
Homeowners may soon be able to store the energy generated ...
The LTC®6363 is a low power, low noise, fully differential ...
See the Virtex® UltraScale+™ FPGA with 32.75G backplane ...
Vincent Ching, applications engineer at Avago Technologies, ...
The LT®6375 is a unity-gain difference amplifier which ...
The LTC®4015 is a complete synchronous buck controller/ ...
10:35
The LTC®2983 measures a wide variety of temperature sensors ...
The LTC®3886 is a dual PolyPhase DC/DC synchronous ...
The LTC®2348-18 is an 18-bit, low noise 8-channel ...
The LT®3042 is a high performance low dropout linear ...