The OSATs can probably compete against TSMC on cost basis but TSMC can still push their new packaging capabilities on grounds of better resolution of chip - package integration issues or just hold back on wafer supply.
But one would think that TSMC will target its capabilities for the higher end of packaging ( e,g. MCMs using Flip Chip and 3D using TSVs ) in order to justify their higher margins.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.