The OSATs can probably compete against TSMC on cost basis but TSMC can still push their new packaging capabilities on grounds of better resolution of chip - package integration issues or just hold back on wafer supply.
But one would think that TSMC will target its capabilities for the higher end of packaging ( e,g. MCMs using Flip Chip and 3D using TSVs ) in order to justify their higher margins.
NASA's Orion Flight Software Production Systems Manager Darrel G. Raines joins Planet Analog Editor Steve Taranovich and Embedded.com Editor Max Maxfield to talk about embedded flight software used in Orion Spacecraft, part of NASA's Mars mission. Live radio show and live chat. Get your questions ready.
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