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re: TSMC to expand IC-packaging efforts
unknown multiplier   4/26/2011 8:54:15 AM
You know, I have some bad feeling of consolidation in packaging sector down the line...

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re: TSMC to expand IC-packaging efforts
double-o-nothing   4/26/2011 8:29:59 AM
It's intriguing, maybe inevitable. So I guess we would expect Samsung and Intel to do the same?

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re: TSMC to expand IC-packaging efforts
Warren3   4/7/2011 10:08:21 PM
And to improve outcomes - by having it all in-house and well-coordinated; especially important, I'd venture, for heterogeneous TSV-based stacks.

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re: TSMC to expand IC-packaging efforts
chipmonk0   4/7/2011 5:57:07 PM
The OSATs can probably compete against TSMC on cost basis but TSMC can still push their new packaging capabilities on grounds of better resolution of chip - package integration issues or just hold back on wafer supply. But one would think that TSMC will target its capabilities for the higher end of packaging ( e,g. MCMs using Flip Chip and 3D using TSVs ) in order to justify their higher margins.

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re: TSMC to expand IC-packaging efforts
goafrit   4/7/2011 1:00:10 PM
Sometimes, I just think that TSMC has nothing more to do. It is interesting how this great company is winning. Congrats for this expansion. More revenue.

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