The OSATs can probably compete against TSMC on cost basis but TSMC can still push their new packaging capabilities on grounds of better resolution of chip - package integration issues or just hold back on wafer supply.
But one would think that TSMC will target its capabilities for the higher end of packaging ( e,g. MCMs using Flip Chip and 3D using TSVs ) in order to justify their higher margins.
Drones are, in essence, flying autonomous vehicles. Pros and cons surrounding drones today might well foreshadow the debate over the development of self-driving cars. In the context of a strongly regulated aviation industry, "self-flying" drones pose a fresh challenge. How safe is it to fly drones in different environments? Should drones be required for visual line of sight – as are piloted airplanes? Join EE Times' Junko Yoshida as she moderates a panel of drone experts.