Breaking News
Comments
Newest First | Oldest First | Threaded View
docdivakar
User Rank
Manager
re: Flip-chip market seen in growth phase
docdivakar   4/25/2011 7:09:23 PM
NO RATINGS
@Dylan McGrath: yes, Flipchip has been growing for years now. The new growth is also coming from non-solder based bumps (conductive adhesives) which can be placed not just on substrates but also on Si interposers which are now growing in 2.5D integration. The Si interposers are taking some of the limitations on number of I/O's away because of their accommodation of less than 3mil lines and pitch. @chipmonk: to partially answer your question as to why more ASAT's are not getting in to the act -basically it is an IP issue. There are two major IP holders for bumping technology and the associated underbump metallurgy (UBM) patents, which are Unitive (bought out by Amkor) and FlipChip Technologies. Other reasons could be the development of processes on a large volume scale. Most are bonded thermosonically but the process parameters change significantly for solders, conductive adhesives, microbumpts of different metals and Cu pillars. Dr. MP Divakar

chipmonk0
User Rank
CEO
re: Flip-chip market seen in growth phase
chipmonk0   4/13/2011 5:05:47 PM
NO RATINGS
Current growth of flip chip is linked to the growth in portable electronics e,g. smart phones. Profit margin for flip chip is still higher than older packaging technologies. Even Cu uPillar bump technology which is being touted by the established OSATs ( with operations in the Far East ) as leading edge and being marketed at a premium has actually been in production in one form or another in the US for nearly 15 years and the technology is stable & easily transferable. Capital requirements for wafer bumping & flip chip / WLP are relatively modest ( $ 100 million ). So why are more OSATs ( e,g. from China ) NOT getting into the act ?

mranderson
User Rank
Rookie
re: Flip-chip market seen in growth phase
mranderson   4/13/2011 6:04:22 AM
NO RATINGS
Flipchip is currently cost competitive due to gold prices, but it also can have design drawbacks. I think more effort will be put into finding a novel mix cheaper materials than gold for bonding.



Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Feast Your Orbs on My Jiggly Exercise Machine
Max Maxfield
52 comments
Last weekend, I was chatting with my mother on the phone. She's all excited that I'm coming over to visit for a week in November. "I'll be seeing you in only seven weeks," she trilled ...

Glen Chenier

Missing Datasheet Details Can Cause Problems
Glen Chenier
3 comments
It is often said that "the devil is in the details." All too often those details are hidden deep within a datasheet, where you can easily overlook them. When a datasheet reference circuit ...

David Blaza

RadioShack: The End Is Nigh!
David Blaza
123 comments
I'm feeling a little nostalgic today as I read about what looks like the imminent demise of RadioShack, at least as we currently know it. An old ubiquitous cartoon image popped into my ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
47 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...