If assembly is so complex and delicate, why not at the end they epoxy mold whole assembly? This may give better thermal performance and may also be more reliable. And it will be difficult to disassemble.
Talking about Apple & Nokia , the mother of all news is here. Apple just surpassed Nokia in handset revenues! Rick you are going to do an article on this. Aren't you?
As we unveil EE Times’ 2015 Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. Panelists Dan Armbrust (investment firm Silicon Catalyst), Andrew Kau (venture capital firm Walden International), and Stan Boland (successful serial entrepreneur, former CEO of Neul, Icera) join in the live debate.