If assembly is so complex and delicate, why not at the end they epoxy mold whole assembly? This may give better thermal performance and may also be more reliable. And it will be difficult to disassemble.
Talking about Apple & Nokia , the mother of all news is here. Apple just surpassed Nokia in handset revenues! Rick you are going to do an article on this. Aren't you?
A Book For All Reasons Bernard Cole1 Comment Robert Oshana's recent book "Software Engineering for Embedded Systems (Newnes/Elsevier)," written and edited with Mark Kraeling, is a 'book for all reasons.' At almost 1,200 pages, it ...