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geekmaster
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re: Record fab tool spending projected in 2011
geekmaster   6/8/2011 6:01:44 PM
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The fabs which are build to be 450mm-ready are quite known such as Intel and TSMC. Samsung is also "hot" as Dylan says. Then there are some R&D/pilot ready facilities such as IMEC and CNSE has plans (they have already a couple of 450mm tools).

mcgrathdylan
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re: Record fab tool spending projected in 2011
mcgrathdylan   6/8/2011 4:40:46 PM
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Intel is the main force pushing for 450, yes, but TSMC and Samsung are also hot for it. I'd guess the other big foundries and some of the memory companies may also adopt it, but I don't think they'll be first in line.

Neo10
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re: Record fab tool spending projected in 2011
Neo10   6/8/2011 2:06:09 AM
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This forecast assumes a lot, like how do they know that how many of the fabs which are going to be constructed are of 450mm and what is cost implication of going from 300 to 450mm, I believe it should reduce if taken per wafer or per sqcm. The 450 mm fabs are not actually demanded by the supply side but more of a move toward higher sizes to reduce cost per die. And who are they guessing are going for 450mm- Intel, yes but who else?

mcgrathdylan
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re: Record fab tool spending projected in 2011
mcgrathdylan   6/7/2011 11:13:09 PM
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Are investments in pilot line 450-mm equipment really going to be made next year? Who will have the tools available?



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As data rates begin to move beyond 25 Gbps channels, new problems arise. Getting to 50 Gbps channels might not be possible with the traditional NRZ (2-level) signaling. PAM4 lets data rates double with only a small increase in channel bandwidth by sending two bits per symbol. But, it brings new measurement and analysis problems. Signal integrity sage Ransom Stephens will explain how PAM4 differs from NRZ and what to expect in design, measurement, and signal analysis.

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