Embedded Systems Conference
Breaking News
Comments
Newest First | Oldest First | Threaded View
docdivakar
User Rank
Author
re: On the road: DAC diversifies, caters to core audience
docdivakar   6/23/2011 10:24:36 PM
NO RATINGS
As far as EDA market is concerned, until there is an integrated flow there won't be a large market for 3D tools. The existing tools will be brute-forced to get by!. I would argue the 2.5D using Si interposers will lead the market for a while, till TSV-enabled multiple stacks of substrates become commonplace. The drivers for these are several: 1. There is simply not enough space to connect chip packages with a large number of I/O's to the board -the design rules in board layout are limiting, most at 3mil width/spacing. So multiple dice have to co-habit the same substrate in a BGA package. This chip-to-chip driver interconnecting will drive a number of communication IC products for a foreseeable future. This is where the Xilinx's, Altera's will put their effort as you also note. 2. Diminishing latency budget in chip-to-chip communication: examples abound in 40G/100G backplane market, another driver for integrating multiple substrates of IC's that interconnect with each other and are challenged by the prop delays by having to go thru a long, challenging paths. Si interposers provide the most optimum way to interconnect between chips. 3. Integration of passives, including planar magnetics: inductors and capacitors for bypassing / decoupling, power management functions, etc., are easier to to implement with Si interposers. Dr. MP Divakar

old account Frank Eory
User Rank
Author
re: On the road: DAC diversifies, caters to core audience
old account Frank Eory   6/12/2011 10:01:34 PM
NO RATINGS
3-D integration, TSVs and stacked die are a huge new area of opportunity for EDA. As these become more common, we designers need EDA solutions to help us ensure 1st pass success with system-in-package (SIP) solutions. The mechanical engineering issues (heat transfer, etc.) are right up there with the traditional electrical issues (timing, signal integrity) that tools need to attack. Not every IC package will contain a single 28 nm or 32 nm die -- this is quite clear from the economics. But those multi-die packages that for some applications are the most cost-effective solution need a lot more EDA support that exists today.

Kinnar
User Rank
Author
re: On the road: DAC diversifies, caters to core audience
Kinnar   6/10/2011 8:29:21 PM
NO RATINGS
EDA tools will be having a lot research and development due to the IPs, After reading through the glimpses of the DAC it seems that there are many lookouts to be catered in future.



Radio
NEXT UPCOMING BROADCAST
In conjunction with unveiling of EE Times’ Silicon 60 list, journalist & Silicon 60 researcher Peter Clarke hosts a conversation on startups in the electronics industry. One of Silicon Valley's great contributions to the world has been the demonstration of how the application of entrepreneurship and venture capital to electronics and semiconductor hardware can create wealth with developments in semiconductors, displays, design automation, MEMS and across the breadth of hardware developments. But in recent years concerns have been raised that traditional venture capital has turned its back on hardware-related startups in favor of software and Internet applications and services. Panelists from incubators join Peter Clarke in debate.
Flash Poll
Top Comments of the Week
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
Special Video Section
Chwan-Jye Foo (C.J Foo), product marketing manager for ...
The LT®3752/LT3752-1 are current mode PWM controllers ...
LED lighting is an important feature in today’s and future ...
Active balancing of series connected battery stacks exists ...
After a four-year absence, Infineon returns to Mobile World ...
A laptop’s 65-watt adapter can be made 6 times smaller and ...
An industry network should have device and data security at ...
The LTC2975 is a four-channel PMBus Power System Manager ...
In this video, a new high speed CMOS output comparator ...
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.