Using mA current instead of nA current can surely help analyzing circuits faster. I am not aware of the history of the ion-beams as to why other companies did not use higher current before. One hurdle that i can think of is higher charge interaction thus loss in resolution.
3-D chip makers can now accelerate their development efforts with FEI's new Vion too, according to Fraunhofer, the European research lab that is developing advanced chip stacks. MEMS devices, which also work on the micron-scale, should be able to benefit from quicker metrology and characterization.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.