Isn't it late for KLA to join in especially when the plans to introduce EUV is by 2012-2013? There would be significant metrology challenges and i am not sure whether the development of metrology for optical can be used for other litho tools.
CNSE is precisely available to try out the next generation lithography choices. It is a research environment might not be practical for years. But ti does two things: research to find alternatives to hurdles seen today, and teaching next-generation litho guys the ropes of the trade. Sometimes our patience fuse is too short as far as litho progress is concerned. KLA's a important metrology player in the next-gen equation: if you can't measure it, you can't build it.
I mean wrap as in close it, for the reasons you stated, given the timing inconsistency. Intel and Samsung were included in the Nikkei news, and they are the main drivers, but it's not consistent with their schedule.
A wrap as in going into production as is? My understanding is that there are still some significant issues with EUV, including the lack of an EUV pellicle as well as questions about the power sources and other issues.
What are the engineering and design challenges in creating successful IoT devices? These devices are usually small, resource-constrained electronics designed to sense, collect, send, and/or interpret data. Some of the devices need to be smart enough to act upon data in real time, 24/7. Are the design challenges the same as with embedded systems, but with a little developer- and IT-skills added in? What do engineers need to know? Rick Merritt talks with two experts about the tools and best options for designing IoT devices in 2016. Specifically the guests will discuss sensors, security, and lessons from IoT deployments.