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peterh123
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re: Older packaging technology breathes new life into automobile MEMS sensors
peterh123   8/10/2011 8:07:56 PM
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The observation that MEMS packaging has been leading the 3D heterogenous packaging trends for a while is definitely true. At Silex, we have had 2.5D/3D interposers and TSV based packaging in volume production for 5 years. While costs are definitely higher than wirebond alternatives, for applications requiring minimum footprint it is definitely viable and available today.

docdivakar
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re: Older packaging technology breathes new life into automobile MEMS sensors
docdivakar   7/25/2011 6:45:22 PM
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@DrQuine: yes, breathalyzers have been around for a while now. Many portable ones are dropping in price owing to progress made in MEMS technology. SafeMate by Alcometers is a good example of one that sells for $19.95: http://www.breathalyzeralcoholtester.com/safemate-portable-breathalyzer.html Another example: http://www.craigmedical.com/Breathalyzer.htm The cost of goods sold (COGS) for a steering integrated one can be 1/4 of the handheld ones and are powered directly by the automobile's electrical system. As you mentioned, these are installed for drivers with a DUI record. But some EU countries are going on a preventive initiative for all drivers! MP Divakar

docdivakar
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re: Older packaging technology breathes new life into automobile MEMS sensors
docdivakar   7/25/2011 6:25:03 PM
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@resistion: thank you for the comments, part of what you say is accurate. But I think the industry will pursue shrinking to finer features for a while before monolithic takes hold. Stacking in the meanwhile will start to mature once the cost of TSV's comes down. 2.5D via Si interposers seems to be stepping ahead of 3D stacking and may lead for next few years. Both are driven by space limits, interconnect parasitics and limitations of packages for large I/O's. MP Divakar

resistion
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re: Older packaging technology breathes new life into automobile MEMS sensors
resistion   7/24/2011 11:17:05 AM
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The trend toward SoC is causing 3D SiP to be considered only for linking standalone commodity chips like memory. But memory may also choose to go 3D monolithically.

DrQuine
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re: Older packaging technology breathes new life into automobile MEMS sensors
DrQuine   7/19/2011 2:35:05 PM
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Automobile breathalyzer "Ignition interlock devices" (see Wikipedia) are well established technologies. As of 2009, most states have laws permitting the imposition of ignition-interlock devices as sentencing alternatives for drunken drivers.

selinz
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Manager
re: Older packaging technology breathes new life into automobile MEMS sensors
selinz   7/19/2011 2:13:00 AM
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Nice article. A recent keynote speaker at SWTest conference suggested that 70% of all packaging still uses good ole fashioned wirebonding. These markets are so price sensitive that it's difficult to move away from the entrenched capacity. But it's happening with WLP, etc. Interestingly, the automotive is very reliability focussed. With wafer level test and burn-in becoming commonplace, we are seeing more advanced packaging here too.

Tunrayo
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re: Older packaging technology breathes new life into automobile MEMS sensors
Tunrayo   7/18/2011 10:32:12 AM
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Hmm, integrated breathalyzers ... I wonder how those would work. I suppose offenders would have to wear a mask over their nose so as not to give any clues away. :-) Integrated breathalyzers would surely be a great addition to cars. However, I guess the government would have to enforce such regulation as some car manufacturers may be reluctant to introduce this technology for fear of impact on their sales.

junko.yoshida
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Blogger
re: Older packaging technology breathes new life into automobile MEMS sensors
junko.yoshida   7/18/2011 10:02:03 AM
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Sorry, that was my typing error. The link is now corrected!

goafrit
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Manager
re: Older packaging technology breathes new life into automobile MEMS sensors
goafrit   7/16/2011 12:31:49 PM
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thanks for this update

docdivakar
User Rank
CEO
re: Older packaging technology breathes new life into automobile MEMS sensors
docdivakar   7/15/2011 7:33:04 PM
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Please note the correct link for Dr. Horst Theuss: http://semiconwest.org/node/7301



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