Design Con 2015
Breaking News
Comments
Newest First | Oldest First | Threaded View
resistion
User Rank
CEO
re: TI touts 3-D packaging technology
resistion   8/5/2011 10:46:45 AM
NO RATINGS
To different degrees, other companies have carried out similar disclosures, particularly DRAM makers like Elpida, Hynix, Samsung. But the ownership of heterogeneous integration is TBD.

yalanand
User Rank
Rookie
re: TI touts 3-D packaging technology
yalanand   8/5/2011 9:50:34 AM
NO RATINGS
This is great news indeed. So in future we can have smaller and more efficient IC's. Just curious to know if only TI is following 3-D packaging tech? What about Intel and other semiconductor giants?

ReneCardenas
User Rank
Rookie
re: TI touts 3-D packaging technology
ReneCardenas   7/29/2011 9:04:07 PM
NO RATINGS
Is this marketing shout out to the world of another me too capability from TI?

resistion
User Rank
CEO
re: TI touts 3-D packaging technology
resistion   7/28/2011 3:53:05 PM
NO RATINGS
I kind of agree with Dr. Divakar. This is one of the simpler more established examples of 3D packaging, and doesn't touch on the issues that for example, TSV-based systems might face, such as accumulating thermals, keep-out zones and parasitics.

GREAT-Terry
User Rank
CEO
re: TI touts 3-D packaging technology
GREAT-Terry   7/28/2011 3:18:48 PM
NO RATINGS
3D package is a good idea, if the cost of manufacturing won't up much and yield can still maintain good. Power device surely is a good idea, especially the way the MOSFET is placed can't be no more shorter than this! Hope to see more companies jump into this area and produce smaller yet powerful products.

Dave.Dykstra
User Rank
Rookie
re: TI touts 3-D packaging technology
Dave.Dykstra   7/28/2011 5:41:33 AM
NO RATINGS
I think the point here is not whether or not the technology is new, but how well it is implemented, manufactured, and shipped in volume. And yes, we should expect to see many more devices in the future using this technology in more complex ways.

docdivakar
User Rank
CEO
re: TI touts 3-D packaging technology
docdivakar   7/27/2011 8:30:06 PM
NO RATINGS
@Dylan: I hate to rain on TI's parade but there is not much new in their "vertical" technology. Back in 2003, I worked on this idea (along with a former colleague at Power One) and extended it to integrate the MOSFET driver in the same package using Carsem's 38Lead MLP Quad Package (8x4mm). The innovation also used Cu-clips to bond with the source digit-like source pads. The source-to-drain stacking between high side and low side MOSFETs can be done with yesterday's technology, not needing any TSV's! I understand IR and other power electronics players were also working on similar concepts. MP Divakar

_hm
User Rank
CEO
re: TI touts 3-D packaging technology
_hm   7/27/2011 8:21:28 PM
NO RATINGS
This is very good news. With advent of this 3D packaging, TI can introduce many novel features in their product and make SoC very effective. We will see many more product with more complex 3D packaging technology.

goafrit
User Rank
Manager
re: TI touts 3-D packaging technology
goafrit   7/27/2011 7:46:12 PM
NO RATINGS
The number does not tell the whole picture. Simply, has the market share increased from what it used to be?



Top Comments of the Week
Flash Poll
Like Us on Facebook

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
<b><a href=Betajet">

The Circle – The Future's Imperfect in the Present Tense
Betajet
5 comments
The Circle, a satirical, dystopian novel published in 2013 by San Francisco-based writer Dave Eggers, is about a large, very powerful technology company that combines aspects of Google, ...

Max Maxfield

Recommended Reads From the Engineer's Bookshelf
Max Maxfield
27 comments
I'm not sure if I read more than most folks or not, but I do I know that I spend quite a lot of time reading. I hate to be idle, so I always have a book or two somewhere about my person -- ...

Martin Rowe

Make This Engineering Museum a Reality
Martin Rowe
Post a comment
Vincent Valentine is a man on a mission. He wants to make the first house to ever have a telephone into a telephone museum. Without help, it may not happen.

Rich Quinnell

Making the Grade in Industrial Design
Rich Quinnell
16 comments
As every developer knows, there are the paper specifications for a product design, and then there are the real requirements. The paper specs are dry, bland, and rigidly numeric, making ...

Special Video Section
The LT8640 is a 42V, 5A synchronous step-down regulator ...
The LTC2000 high-speed DAC has low noise and excellent ...
How do you protect the load and ensure output continues to ...
General-purpose DACs have applications in instrumentation, ...
Linear Technology demonstrates its latest measurement ...
10:29
Demos from Maxim Integrated at Electronica 2014 show ...
Bosch CEO Stefan Finkbeiner shows off latest combo and ...
STMicroelectronics demoed this simple gesture control ...
Keysight shows you what signals lurk in real-time at 510MHz ...
TE Connectivity's clear-plastic, full-size model car shows ...
Why culture makes Linear Tech a winner.
Recently formed Architects of Modern Power consortium ...
Specially modified Corvette C7 Stingray responds to ex Indy ...
Avago’s ACPL-K30T is the first solid-state driver qualified ...
NXP launches its line of multi-gate, multifunction, ...
Doug Bailey, VP of marketing at Power Integrations, gives a ...
See how to ease software bring-up with DesignWare IP ...
DesignWare IP Prototyping Kits enable fast software ...
This video explores the LT3086, a new member of our LDO+ ...
In today’s modern electronic systems, the need for power ...