Breaking News
Comments
Newest First | Oldest First | Threaded View
Page 1 / 2   >   >>
adelestuart
User Rank
Rookie
re: TSMC's A6 processor to respin, says report
adelestuart   6/10/2013 1:52:40 PM
NO RATINGS
Seems to be a good processor and for sure many will use it. http://www.fatherofthegroom-speeches.com/

GREAT-Terry
User Rank
CEO
re: TSMC's A6 processor to respin, says report
GREAT-Terry   8/16/2011 9:19:05 AM
NO RATINGS
Is TSMC the only foundry capable for the 28nm and 3-D packaging together? If yes, Apple doesn't have to worry anything about. They just need some more marketing work to extend the lifetime of iPad2. I still believe Apple can dominate the tablet market by next Q1. So, if TSMC can fix the issue in time while it leaves enough time for Apple to refine the product, the new iPad may be more sexy! BTW, it is not too long to wait from iPad2 ato iPad3 (at least I don't think so).

resistion
User Rank
CEO
re: TSMC's A6 processor to respin, says report
resistion   8/15/2011 12:25:25 AM
NO RATINGS
Could the interposer become a standard part of tsmc's 28 nm back end? If so, Apple would not be the only beneficiary, but also Nvidia, Qualcomm, etc.

p_g
User Rank
Rookie
re: TSMC's A6 processor to respin, says report
p_g   8/14/2011 9:32:27 PM
NO RATINGS
Not sure if package need major change, yes some internal changes are required. Regarding risk, probably its worth taking that risk since stcked dioe give benifit of speed and power which will give them market edge. Even if they fail for first time atleast they will be ahead of market by one step to implement this.

p_g
User Rank
Rookie
re: TSMC's A6 processor to respin, says report
p_g   8/14/2011 9:26:54 PM
NO RATINGS
@dylan; I agree with you. Samsung has good revenue in fab coming from Apple. But key thing is if Apple withdrew then can Samsung keep its fab busy? I don't think Samsung fab want to give up just for Galaxy at the same time Apple is preparing for worst case too.

chipmonk0
User Rank
CEO
re: TSMC's A6 processor to respin, says report
chipmonk0   8/14/2011 5:53:48 PM
NO RATINGS
3-d stack memory module integrated on an interposer w/ a CPU on the other side would definitely help both power consumption and bus throughput( shorter lengths ) in handheld systems. Apple often takes leadership at the system integration level but is not known for sticking its neck out to the bleeding edge of component ( e,g. die ) technology. Indulging in 3-d stack memory ( wide I/O bus ) would require getting involved in Semiconductor Physics ? Does Apple have the manpower to handle these problems yet ? What would be a Killer App for Apple to justify it ? TV in a Smart Phone ? 3-d stacking has issues. First heat dissipation ( so initial applications will not include the CPU ), then stress ( efect of flexing in through silicon vias affecting device performance, hence requiring wide keep - outs / die real estate ). Perhaps right now Apple is just testing the waters and getting the Suppliers ready. Application in real systems will have to wait for 2 - 3 years.

resistion
User Rank
CEO
re: TSMC's A6 processor to respin, says report
resistion   8/12/2011 7:35:46 PM
NO RATINGS
Last month NVIDIA reported pushing out its 28 nm GPU by a year. Could be same issue here: 28 nm yield.

resistion
User Rank
CEO
re: TSMC's A6 processor to respin, says report
resistion   8/12/2011 7:25:57 PM
NO RATINGS
Any stacked memory dies would have to be compatible with the new package, but we did not hear about adjustments by them. For Xilinx, FPGA dies were side by side on same interposer, but all the dies were made at tsmc, as well as interposer. I don't know why Apple and tsmc would take such risk so soon. I think the 28 nm yield is hard enough already, and could be the real issue.

_hm
User Rank
CEO
re: TSMC's A6 processor to respin, says report
_hm   8/12/2011 6:30:40 PM
NO RATINGS
This may be another good example of how Apple respect its designers. Design team of A6 may need more time to optimize product and specification and they may need one or more run. It is is not good practice to fix product launch date before design team agrees to design progress. One wrong example from Apple was iPhone4 Antenna. They should have given more time to RF/Microwave engineers for testing and refinement.

mcgrathdylan
User Rank
Blogger
re: TSMC's A6 processor to respin, says report
mcgrathdylan   8/12/2011 5:24:36 PM
NO RATINGS
@p_g- But can Apple continue to rely on Samsung for producing its processors while at the same time engaging in a legal battle with the South Korean firm over the Galaxy Tab? Seems like something's gotta give.

Page 1 / 2   >   >>


Flash Poll
Top Comments of the Week
Like Us on Facebook
EE Times on Twitter
EE Times Twitter Feed

Datasheets.com Parts Search

185 million searchable parts
(please enter a part number or hit search to begin)
EE Life
Frankenstein's Fix, Teardowns, Sideshows, Design Contests, Reader Content & More
Max Maxfield

Saddleback Sale – It's Happy Dance Time
Max Maxfield
Post a comment
It's no secret that I'm a huge fan of the products from Saddleback Leather. As I sit here at my desk, I'm wearing one of their 1¾" wide Tow Belts, upon which rests one of their Belt ...

Engineering Investigations

Air Conditioner Falls From Window, Still Works
Engineering Investigations
1 Comment
It's autumn in New England. The leaves are turning to red, orange, and gold, my roses are in their second bloom, and it's time to remove the air conditioner from the window. On September ...

David Blaza

The Other Tesla
David Blaza
5 comments
I find myself going to Kickstarter and Indiegogo on a regular basis these days because they have become real innovation marketplaces. As far as I'm concerned, this is where a lot of cool ...

Larry Desjardin

Engineers Should Study Finance: 5 Reasons Why
Larry Desjardin
47 comments
I'm a big proponent of engineers learning financial basics. Why? Because engineers are making decisions all the time, in multiple ways. Having a good financial understanding guides these ...